Big Audio IC for Apple iPhone X Plus

The Big Audio IC in your Apple Iphone X Plus is the primary, high-power audio codec chip that manages the entire audio pipeline — including loudspeaker output, earpiece, microphone input, headphone routing, and call audio processing. It is physically larger and more powerful than a standard Audio IC and handles higher output demands. When it fails, all audio functions on your Apple Iphone X Plus typically fail simultaneously rather than just one channel.

Symptoms include complete loss of all audio output across every channel — loudspeaker, earpiece, and headphone jack all failing together — severe distortion across all audio outputs, microphone failure alongside speaker failure, and audio issues that persist regardless of software resets or settings changes on your Apple Iphone X Plus.

Yes. Because the Big Audio IC manages both audio input and output on the Apple Iphone X Plus, a failure can knock out both the speaker and the microphone simultaneously. If your Apple Iphone X Plus has both speaker and mic failure at the same time, the Big Audio IC is the most likely single point of failure to investigate.

No. The Big Audio IC is a large BGA or QFN chip soldered directly onto the Apple Iphone X Plus motherboard. Replacement requires a hot air rework station, correct stencil, flux, microscope, and professional board-level repair experience. Attempting this without proper equipment will permanently damage the motherboard.

Yes — a 7-day replacement warranty covering manufacturing defects is included. An unboxing video is mandatory for all warranty claims. Once the chip has been soldered it is considered used and cannot be returned. For more information, check out SAHII's Return Policy.