Samsung Galaxy S6 Motherboard Replacement

Insert a SIM eject tool into the hole in the SIM card slot.

• Press gently to eject the SIM card tray.

Avoid applying excessive force, which may damage the SIM card tray.

Remove the SIM card tray.

Clean the microwave thoroughly before proceeding to prevent any debris from adhering to the iOpener.

• Position the iOpener in the center of the microwave.
• For carousel microwaves, ensure the plate rotates freely to avoid overheating or burning the iOpener during use.

Risk of overheating or bursting: Do not heat over 100 °C (212 °F).

• Heat the iOpener in a microwave for thirty seconds.

• Be cautious of overheating, which may cause bursting.

• As the iOpener cools, reheat it in short thirty-second intervals.

A swollen or excessively hot iOpener should not be touched; wait for it to cool.

Avoid touching the center of the iOpener as it can cause burns.

• Hold the iOpener by one of its flat ends to prevent burns from the hot center.
• If handling the iOpener is uncomfortable, use an oven mitt for extra protection.

Boiling water poses a burn risk.

• Fill a pot or pan with enough water to submerge an iOpener.
• Heat the water to a boil, then turn off the heat source.
• Submerge an iOpener in the hot water for 2-3 minutes.
• Use tongs to remove the heated iOpener.
• Dry the iOpener with a towel.

• Caution: The iOpener will be extremely hot.

• Hold the iOpener only by the end tabs.

The heated iOpener is now ready for use. To reheat, repeat the process.

Opening your phone will compromise its waterproof seals.

• Prepare replacement adhesive before proceeding, or carefully avoid liquid exposure during reassembly.
• Apply packing tape over a shattered glass panel to hold it together during removal.

Use the iOpener:

• Lay the heated iOpener on the rear panel for about two minutes to loosen adhesive.
• You may need to reheat and reapply several times to achieve desired temperature.
• Shift the iOpener to heat remaining sections for another two minutes.

When using alternative heating sources (hair dryer, heat gun, hot plate), avoid overheating:

• Avoid damaging the OLED display and internal battery with excessive heat.

Apply a suction cup near the bottom edge of the heated rear glass.

• Lift on the suction cup to create a small gap underneath the rear glass.
• Insert an opening pick into the gap.

Optionally, add a few drops of isopropyl alcohol into the gap for weakened adhesive in following steps.

Slide the pick along the bottom edge of the phone to slice through the adhesive.

• Leave the pick in place, then grab a second pick.

• Re-heat the rear glass as needed to prevent the glue from cooling and hardening.

Repeat the heating and cutting process for the remaining three sides.

• Place a new opening pick under each edge, ensuring not to remove existing ones.

Use an opening pick to cut through any remaining adhesive.

• Remove the rear glass.

Remove any remaining adhesive from the phone's chassis using tweezers.

• Clean the adhesion areas with at least 90% isopropyl alcohol and a lint-free cloth.
• Swipe in one direction only to prep the surface for new adhesive.

Apply the new rear glass carefully, lining up one edge against the phone chassis, then press firmly into place.

Remove thirteen 3.5mm Phillips #00 screws holding the midframe to the phone.

Ensure the SIM card tray has been ejected.

• Grasp the midframe assembly's edge firmly.
• Lift the midframe while pressing down on the battery to separate it from the phone's body.
• Avoid snagging the audio jack or charging port with the midframe.

Be cautious not to insert the opening pick between the glass and display.

• Run an opening pick around the edges of the phone, separating the top of the midframe.
• To disengage the headphone jack safely, remove the top of the midframe first.

If separation is difficult, apply heat to the display edges with an iOpener and gently pry apart the midframe.

Release the midframe assembly by lifting it upwards.

• Gently lift the midframe to break its bond with the phone casing.

Disconnect the battery connector using the flat end of a spudger.

Disconnect the Bluetooth and Wi-Fi antenna cable from its socket on the motherboard using the pointed edge of a spudger.

Disconnect the home button connector with the flat end of a spudger.

Disconnect the display assembly cable from the motherboard using the flat end of a spudger.

Disconnect the earpiece speaker assembly cable from the motherboard.

Ensure the motherboard is fully disconnected before proceeding.

• Lift the camera-side end of the motherboard, moving any ribbon cables as necessary.
• Verify the board can be lifted freely, and check for any cable obstructions.

Do not remove the motherboard yet - it remains attached to the daughterboard via a hidden ribbon cable.

Disconnect the daughterboard ribbon cable using the flat end of a spudger.

Disconnect the front-facing camera using the flat end of a spudger.

Remove the camera.

Disconnect the rear-facing camera using the flat end of a spudger.

• Use the flat end of the spudger to avoid damaging components.
• Remove the camera assembly once disconnected.