Removing the rear glass will destroy its adhesive and render it unusable for reinstallation.
Insert a paper clip or SIM eject tool into the hole in the SIM card slot on top of the phone.
Dirty microwave interiors can damage the iOpener. Clean the microwave thoroughly.
Do not attempt to heat above 100 ̊C (212 ̊F).
Overheating may cause the iOpener to burst.
Never touch a swollen or very hot iOpener.
Avoid touching the hot center when removing the iOpener from the microwave.
Careful handling required: The heated iOpener will be very hot.
If reheating, repeat the process.
Opening your phone compromises its waterproof seals.
Use caution when heating the phone: OLED display and internal battery are susceptible to heat damage.
Alternative heat sources: hair dryer, heat gun, or hot plate. However, be careful not to overheat the phone.
Apply a suction cup near the bottom edge of the rear glass when it's hot.
Slide a pick along the bottom edge of the phone, cutting through adhesive.
Leaving the pick inserted can help prevent re-adhering glue.
Use a opening pick to remove any remaining adhesive.
Peel away any remaining adhesive from the phone's chassis with tweezers.
Avoid cross-contamination when cleaning — swipe the cloth in one direction only to prevent spreading debris.
Remove thirteen 3.3mm Phillips #00 screws from the midframe.
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