Samsung Galaxy S6 Edge Earpiece Assembly Replacement

Inserting the tool into the wrong hole can cause damage.

• Identify the SIM card slot on top of the phone and locate the outline of the SIM tray.
• Use a paper clip or SIM eject tool to press the eject button through the correct hole.

Do not insert into the microphone hole.

• The SIM card tray will now eject.
• Remove the SIM card tray from the phone.

Clean the microwave before proceeding to prevent residue from sticking to the iOpener.

• Place the iOpener in the center of the microwave.
• For carousel microwaves:
• Ensure the plate spins freely to avoid overheating and burning the iOpener.

Do not overheat the iOpener above 100 ̊C (212 ̊F), risk of bursting.

• Heat the iOpener for thirty seconds in the microwave.
• Reheat as needed throughout the repair, every thirty seconds at a time.

Never touch the iOpener if swollen or too hot to handle.

• A properly heated iOpener should stay warm for up to ten minutes.
• If the iOpener is still too hot, continue using it while waiting for it to cool further.

Hold the iOpener by one of its flat ends, avoiding the hot center.

Handling the iOpener will be very hot; use an oven mitt if necessary to prevent burns.

Risk of burns: handle heated iOpener with care.

• Fill a pot or pan with enough boiling water to submerge an iOpener.
• Place an iOpener in the hot water and wait 2-3 minutes.
• Use tongs to carefully remove the heated iOpener from the water.
• Dry the iOpener thoroughly with a towel before use.

Repeat heating process as needed, following same steps.

Opening your phone will compromise its waterproof seals.

• Have replacement adhesive ready before proceeding or exercise caution to avoid liquid exposure if reassembling without replacement.
• If the glass is shattered, cover it with packing tape for the removal process.

Apply the heated iOpener to the rear panel for two minutes to loosen the edge adhesive.

• You may need to reheat and reapply the iOpener multiple times to achieve optimal temperature.
• Avoid overheating by following the iOpener instructions.

Use caution when using a hair dryer, heat gun, or hot plate, as they can cause damage to the OLED display and internal battery with excessive heat.

• Shift the iOpener to heat the remaining panel section for another two minutes.

Apply a suction cup near the bottom edge of the rear glass when it's hot to the touch.

• Lift on the suction cup to create a small gap underneath the rear glass.
• Insert an opening pick into the gap.
• Adding a few drops of isopropyl alcohol can help weaken the adhesive in subsequent steps.

Slide a pick along the bottom edge of the phone to separate the adhesive.

• Leave the pick in place to maintain separation.
• Grab a second pick.

Re-heat the rear glass as needed to prevent glue from hardening.

Proceed with heating and cutting on the remaining three sides.

• Insert a pick along each edge, leaving it in place to prevent re-adhesion.

Use a opening pick to slice through remaining adhesive.

• Remove the rear glass.

Remove any remaining adhesive from the phone's chassis with tweezers.

• Clean the adhesion areas with isopropyl alcohol (90% or higher) and a lint-free cloth. Swipe in one direction only.
• Peel the adhesive backing off of the new rear glass and align it carefully with the phone chassis. Press firmly onto the phone.

Note: If reusing the old rear glass, or using rear glass without pre-applied adhesive, follow this guide.

Remove thirteen 3.3 mm Phillips #00 screws from the midframe.

Press the back of the battery firmly.

• Lift up on the edges of the midframe.

Disconnect the battery ribbon cable from the motherboard using the flat end of a spudger.

Remove the home button ribbon cable by disconnecting it from the motherboard.

Disconnect the antenna interconnect cables using the pointed end of a spudger.

Use the flat end of the spudger to disconnect the display ribbon cable from the motherboard.

Disconnect the earpiece ribbon cable from the motherboard.

The motherboard is an ESD sensitive component — handle with care.

• Put on a anti-static bracelet before handling components.
• Grip the motherboard by both edges, near the top of the device.
• Lift the motherboard up and away from the display.

  Do not lift it all the way out yet — disconnect the ribbon cable first.

Remove the daughterboard ribbon cable from the underside of the motherboard.

Do not attempt to lift the earpiece assembly board at this time, as it remains attached to the earpiece speaker assembly.

• Earpiece assembly board remains in place above the earpiece speaker.

Remove the EMI shield.

• The EMI shield is located over the proximity and gesture sensors.

Careful not to strain any cables.

• Remove the earpiece speaker assembly from the phone.