Galaxy S23 Ultra Chip ID
For the Samsung Galaxy S23 Ultra, locate the chip ID.
- Refer to the full teardown guide for more information.
- Credit goes to community member CChin for their contributions.
Step 1 | Main Board Side 1
The device contains the following key components:
- Qualcomm SM8550: 64-bit octa-core processor for applications and baseband operations.
- Micron MT62F1536M64D8CL-026 WT:B: 12 GB of LPDDR5 SDRAM memory.
- Samsung KLUFG8RHHD-B0G1: 512 GB NAND flash memory with an integrated controller.
- Cirrus Logic CS35L42 and Cirrus Logic CS40L26: Audio amplifier and haptic driver, respectively.
- Analog Devices MAX77705C: Power management unit.
- NXP Semiconductor PCA9481UK: Battery charging module.
- Wacom WEZ02: Digitizer controller for touch input.
Step 2
The following components may be present in your device:
- Silicon Mitus SM3080I power management component.
- Samsung S2MPBA3 power management component.
- ConvenientPower CPS4038, a 40 W wireless power receiver with 10 W wireless power transmitter.
- Possibly: Qualcomm envelope tracking power supply.
- Knowles MEMS microphone.
- Possibly: Qualcomm power management component.
- Possibly: NXP Semiconductor load switch.
Step 3 | Main Board Side 1 - Connectivity
The system consists of the following components:
- WCN7851-101 FastConnect 7800: WiFi 7, 6, & 6E and Bluetooth 5.3 transceiver from Qualcomm.
- SR200T ultra-wideband transceiver from NXP Semiconductor.
- SDR735-001 RF transceiver from Qualcomm.
- SMR546-002 RF transceiver from Qualcomm.
- SN220U NFC controller with secure element from NXP Semiconductor.
Step 4 | Main Board Side 1 - Sensors
The device is equipped with a color and proximity sensor, a 6-axis accelerometer and gyroscope from STMicroelectronics, and a pressure sensor.
- TMD4913 is the color and proximity sensor.
- LSM6DSO is the 6-axis accelerometer/gyroscope.
- LPS22HH is the pressure sensor.
Step 5 | Main Board Side 2
The device contains the following components:
- STMicroelectronics STM32G051: 32-bit microcontroller.
- Cirrus Logic CS35L42: Audio amplifier.
- Qualcomm PMK8550: Clock generator.
- Qualcomm PM8550VE-001 and Qualcomm PM8550VS-001: Power management components.
- Samsung S2MPB02: Additional power management component.
- Goertek MEMS Microphone: Input microphone.
Step 6
The system uses a Qualcomm power management module.
- ETEK Microelectronics ET9902 provides over-voltage and surge protection.
- Kinetic Technologies over-voltage protection is also present.
- The NXP Semiconductor NVT4557HK module handles SIM card interface level translation.
- A Vishay DG2730 analog switch is used for DPDT switching.
- An AP7340D-30FS4-7 LDO regulator from Diodes Incorporated supplies power at 150 mA and 3.0 V.
Step 7 | Main Board Side 2 - Connectivity
Identify the components in the device:
- Qualcomm QPM7815-005 front end module
- Qualcomm QPM6810-003 front end module
- Maxscend MXDLN16GE GPS/GLONASS/Galileo/BeiDou low noise amplifier
- Infineon BGSA20UGL8 dual SPST RF switch
Step 8 | Main Board Side 2 - Sensors
Remove the AKM Semiconductor AK09918C electronic compass module from the PCB.
- Disconnect the SCL and SDA pins first.
- Carefully lift the module's corners and gently pry it loose.
Step 9 | Main Board Side 2 - Filters
- Replace the Murata SAYRH634MBA0C0A duplexer.
- Replace the Murata SAFFB722MAA0F0A filter.
- Replace the Murata SAFFB2G45MA0F0A filter for ISM 2.4G SAW frequencies.
- Replace the Murata SAFFB1G17AA0F0A GPS L5 SAW filter.
Step 10 | Charging Port Board Side 1
Be aware that the AH1897T diode may be a Hall effect sensor, but it's also possibly an antenna switch.
- Inspect the package and datasheet for confirmation of the part's function.
Step 11 | Charging Port Board Side 2
Locate the Knowles MEMS microphone.
- Identify and remove the Wisil antenna switch module.
- The Qualcomm antenna tuner is located next. Remove it.
- The second instance of the Qualcomm antenna tuner must also be removed.
- Finally, locate and remove the Maxscend MXDLN16GE GPS/GLONASS/Galileo/BeiDou low noise amplifier.
Step 12 | Display Flex
The device features a touchscreen controller from STMicroelectronics (FJACJ),
NOR flash memory from Winbond (W25Q80EWUXIE, 1 MB capacity),
and fingerprint sensors consisting of a Qualcomm QFS2630 ultrasonic sensor
controlled by a separate Qualcomm QBT2600-100 controller.