Discharge battery below 25% before disassembly to prevent thermal event risk.
Power off your phone completely before starting.
Apply a suction cup to the back of the phone, near the center bottom edge.
Pull up firmly but carefully on the suction cup to create a gap between the back cover and frame.
Insert an opening pick into the gap, but only about 5 mm deep to avoid damaging internal components.
Slide the pick back and forth along the bottom edge to slice through the adhesive.
Do not remove the pick, as this can cause the adhesive to reseal.
Apply iOpener to the left edge of the back cover and heat for 2 minutes.
Insert an opening pick no more than 5 mm into the gap to avoid damaging internal components.
Do not cut past the camera shell — risk of damaging the back cover.
Heat a iOpener and apply it to the right edge of the back cover for two minutes.
Use strong, steady force to create a gap between the back cover and frame.
Insert a pick at the top-right corner of the back cover.
Insert the opening pick into the top-right corner of the phone.
Limit insertion depth to 5 mm to avoid damaging internal components.
The same procedure can be applied to other corners, but not the top-left due to the rear-facing camera.
Apply iOpener to the camera shell for 2 minutes.
Rotate the back cover counterclockwise to create a gap between the camera shell and the frame.
If this method does not work, proceed with caution to the next step for an alternative method; otherwise, skip the next step.
Careful: Risk of cracking the plastic back cover.
Insert an opening pick between the camera shell and frame to break the adhesive bond.
Heating multiple times may be required due to significant adhesive holding the frame in place.
Locate and carefully remove additional adhesive to the right of the camera.
Be aware of a plate around the flash that may cause the pick to get stuck.
Angle the pick downward to prevent damage during removal.
Align the opening pick's tip with your phone's flash.
Remove the back cover.
Remove adhesive chunks with tweezers or fingers.
Use high concentration (over 90%) isopropyl alcohol to clean residue.
Remove the motherboard bracket by unscrewing its five 4 mm Phillips screws.
Label and store each screw to ensure correct reassembly.
Use a pair of tweezers to gently pull up and unclip the motherboard bracket from the frame.
Do not completely remove the bracket yet, as it's still attached to the wireless charging coil.
Hold the motherboard bracket out of the way using tweezers or your fingers.
Misaligned connectors can cause permanent damage by bending pins.
Peel the wireless charging coil off the phone with your fingers.
Be careful not to leave any adhesive residue on the phone's surface.
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