Samsung Galaxy S10e Motherboard Replacement

Do not insert tool into incorrect hole — risk of damage.

• Insert a SIM card eject tool, bit, or straightened paperclip into small hole in SIM tray.
• If inserted incorrectly, do not worry as damage is unlikely.
• Press firmly to eject the tray.

Remove the tray by pulling it straight out.

Opening your phone will compromise its waterproof seals.

• Prepare replacement adhesive beforehand, or take precautions against liquid exposure during reassembly if you choose to skip this step.
• Power off the phone completely before starting the repair.

Softening the back cover adhesive is essential for a successful disassembly. Follow these steps:

• Heat the right edge of the back using an iOpener for approximately two minutes to soften the adhesive.
• Rethink and reapply heat as needed, following the iOpener's instructions to avoid overheating.

Alternatively, a hair dryer, heat gun, or hot plate can be used, but exercise caution to prevent overheating damage to the OLED display and internal battery.

Cut carefully through the adhesive securing the back cover.

• Refer to the first image for the layout of the adhesive after removal.
• Slice through the adhesive in the highlighted areas as seen from the outside of the phone.
• The adhesive is thinnest on the right side, below the Bixby button.

Be cautious when handling a cracked back cover — risk of further damage.

• Attach a suction cup to the back cover near the heated edge, under the Bixby button where adhesive is thinnest.
• Avoid placing the suction cup on the curved portion of the glass as it will not create a seal.
• If your phone's back cover is cracked, use strong tape or superglue to secure the suction cup in place before proceeding.

Prop up the heated phone's edge on a 0.5 inches (13 mm) thick object.

• Lift the back cover's right edge using a suction cup, creating a small gap between the cover and frame.

May require significant force; if needed, reapply heat to soften adhesive, then try again.

• For iOpener users: follow heating instructions to avoid overheating and bursting the gel pack.

Press opening tool into gap carefully, as rear glass may break with excessive force or metal prying tools.

Use the opening tool to slice through the adhesive on the right side of the phone.

Insert a opening pick into the edge adjacent to the opening tool.

Leave the pick in place to prevent re-adhesion of the separated glue.

Apply a iOpener to the top edge of the phone for 2 minutes.

Insert an opening pick near the top right corner of the phone.

• Slide the pick around the corner and across the top edge of the phone.
• For the glued area, insert the pick farther into the phone to separate it.
• Leave the opening pick in place to prevent adhesive re-adhesion.

Apply a iOpener preheated according to its instructions, placing it on the left edge of the phone for 2 minutes.

Insert an opening pick near the top left corner and slide it along the left edge of the phone.

Leave the opening pick in place to prevent the adhesive from resealing.

Heat an iOpener and apply it to the phone's bottom edge for 2 minutes.

Insert a picks near a bottom corner.

• Slide along the bottom edge to separate adhesive.
• Due to larger glued area, insert deeper for full separation.

• Pry up the back cover using the opening picks, applying gentle force.
• If resistance is encountered, stop prying and use an opening pick to carefully cut any remaining adhesive.
• Continue until the back cover can be removed.

Make sure your phone is turned on and functioning before reassembling.

• Optional: Reinstall back cover without replacing adhesive if desired.
• Remove large chunks of old adhesive that may interfere with proper closure.

Note that not using new adhesive will compromise water resistance.

Apply heat to the back cover and press firmly for a secure seal.

Remove the 8 x 3.9mm Phillips screws that hold the upper midframe in place.

Insert an opening pick under the bottom right corner of the upper midframe.

• Work the pick into the gap between the midframes to separate them.
• The goal is to release the adhesive holding the upper midframe in place.

Locate the small cutout on the upper midframe's right edge.

• Insert the point of a spudger into the cutout.
• Pry the midframe up from the phone chassis using the spudger's point.

Remove the midframe by lifting it at the plastic section.

• To reinstall, insert the top edge of the midframe assembly into the phone's frame.
• Gently press down on the rest of the assembly to snap it into place.

Disconnect the battery connector by prying it straight up with the flat end of a spudger.

Remove the seven 3.9 mm Phillips screws using a Phillips driver.

• Insert the spudger into the notch on the right edge of the loudspeaker.
• Pry up gently with the spudger to loosen the loudspeaker.

Remove the loudspeaker by lifting it up.

• To reinstall, align the loudspeaker edges and press firmly until it snaps into place.

Misaligned pin bends may cause permanent damage.

• Use a spudger's flat end to pry up and disconnect the screen connector from its motherboard socket.
• To reattach:
• Align carefully and press down on one side until it clicks into place.
• Repeat on the other side, avoiding the middle.

Be cautious when removing the front facing camera connector as it may damage nearby surface-mounted components.

• Use a spudger to carefully pry up and disconnect the front facing camera connector from its motherboard socket.

Insert the pointed tip of a spudger into the gap between the fingerprint sensor connector and its motherboard socket.

• Pry gently to release any connectors or clips holding it in place.
• Once released, you should be able to lift out the fingerprint sensor connector.

Use a spudger to carefully pry up and release the headphone jack connector from its corresponding motherboard socket.

Be cautious not to mix up these screws with others.

• Use a Phillips driver to remove three 3.7 mm screws:
  • One above the rear-facing camera
  • Two flanking the USB-C port

Use the flat end of a spudger to pry up and loosen the top portion of the motherboard.

• Verify that the SIM/Micro SD tray has been ejected.
• If it still doesn't budge, re-check your work for any obstructions or incorrect component removal.

Lift the top edge of the motherboard out using your fingers.

Gently pull towards the top of the frame to avoid damaging the USB-C port.

Remove the motherboard completely.

• USB-C Port should be seated against the bottom frame edge.
• Align and lay the motherboard into the frame, ensuring no connectors are trapped underneath.

Flip the motherboard over.

• Use a spudger to pry up the two camera connectors, then disconnect them from their motherboard sockets.

Apply a iOpener to the camera module and heat it for 1 minute to loosen the adhesive.

Use your finger to apply firm, steady pressure to the camera module to loosen it from the motherboard.

Remove the dual rear camera module.

Verify that only the motherboard remains on the work surface.

• Compare the motherboard of your new replacement with the original motherboard.
• If necessary, transfer any remaining components or remove adhesive backings from the new part before proceeding.