Samsung Galaxy Note5 Motherboard Replacement

Insert a SIM eject tool, SIM eject bit, or a straightened paperclip into the small hole in the SIM card tray at the top of the phone.

• Press to eject the tray. Be prepared for potential resistance, but do not apply excessive force.
• Once ejected, carefully remove the SIM card tray.

Push the S-Pen button with your finger until it clicks.

• The S-Pen should pop out of the phone.
• Remove the S-Pen.

Taping a cracked glass back can cause further damage.

• Apply packing tape carefully to cover the entire surface.
• Reheat as needed, reapplying the iOpener for about two minutes at a time.
• Use a iOpener or, if preferred, a hair dryer, heat gun, or hot plate.

• Be cautious not to overheat the OLED display and internal battery.

If the back cover is cracked, strong tape or a superglued suction cup may be required for lifting.

• Apply a suction cup as close as possible to the bottom edge of the phone.
• Lift on the suction cup and carefully insert an opening pick under the rear glass.

Avoid using too much force or metal tools, which can cause the fragile rear glass to break.

Reheat the edge with an iOpener for an additional minute.

Slide iSclack tool down bottom edge of phone.

• Move slowly to avoid losing tip in seam.
• If sliding is difficult, reheat and reapply iOpener.

Leave the pick in place to prevent adhesive resealing.

Proceed to next step with another iSclack tool.

The curved phone back makes the glass particularly delicate, prone to breaking at the edges.

• Insert a second pick and carefully cut around the phone's curved corner.
• Apply patience when cutting corners, reapplying an iOpener if necessary for smooth progress.

Apply a heated iOpener to the long edge.

Continue with the heating and cutting process for the remaining three sides.

• Leaving a pick in each edge, move to the next side without removing any of them.
• This prevents the adhesive from resealing between cuts.

• Use an opening pick to scrape away remaining adhesive.
• Lift off the glass and carefully remove it from the phone.

Adhesive failure can lead to water ingress.

• Use tweezers to remove any remaining adhesive from the back cover and phone chassis.
• Clean adhesion areas with 90%+ isopropyl alcohol and a lint-free cloth, swiping in one direction only.

Test your repair before installing new adhesive.

• Apply pre-cut adhesive sheet or Tesa 61395 double-sided tape (note: this leaves gaps vulnerable to liquid intrusion).
• Apply strong, steady pressure for several minutes by placing phone under a stack of heavy books.

Reinstalling without new adhesive can compromise waterproofness.

• If reusing existing adhesive, remove large chunks and apply heat to secure the back cover in place.

Remove all 20 3.3mm Phillips head screws.

Ensure that the SIM tray has been ejected before proceeding.

• Hold the midframe by its edges and lift it upwards, applying pressure against the battery with one finger.
• The midframe is secured to the display assembly via a small amount of adhesive in each corner. Apply constant force until separation occurs.
• Once separated, carefully remove the midframe.

Lift the battery connector straight up from its socket on the motherboard using the flat end of a spudger.

Use the flat end of a spudger to disconnect the earpiece connector.

Disconnect the touchscreen connector using the flat end of a spudger.

Disconnect the display connector using the flat end of a spudger.

Use the flat end of a spudger to disconnect the navigation buttons connector.

Disconnect the antenna cable using the pointed end of a spudger.

Hold the motherboard by the top corners and pivot it upwards.

• Carefully lift the flex cables to clear their path.

Do not detach the motherboard from its daughterboard at this stage.

Use the flat end of a spudger to disconnect the daughterboard connector from the motherboard.

Next, carefully lift and remove the motherboard.