Excessive heat and careless handling can damage phone components.
Replace screens slowly and carefully; excessive force or heat can cause damage.
Remove the back case.
Be careful with the SIM card, as it can be easily damaged.
Use a prying tool to carefully lift the plastic case covering the logic board.
Do not pry on the midframe at the top edge near the screen — risk of damaging the LCD.
Place your prying tool between the screen and case, then lift the plastic case towards the back of the phone, being cautious around the buttons.
The bottom casing has been removed, exposing the motherboard.
Be careful not to damage the logic board or cables.
Ensure the clip is secure before proceeding.
Failure to keep prying tool from going too deep under bezel may scratch LCD.
Be cautious when prying near back button and menu buttons, as they may stick to glass.
Remove all adhesive and replace with new adhesive in its place.
Test device before reassembly by checking screen and functionality.
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