Insert an opening pick into the SIM card tray slot and twist it sideways to loosen the first plastic clip.
Slide the opening pick along all edges of the phone to disengage the rear panel clips.
Insert an opening pick and tilt it to lift the rear panel slightly.
Remove the ten 3.6 mm Phillips screws securing the midframe.
Insert a opening pick into the SIM card tray slot, then twist it sideways to release the plastic clips.
Slide the opening pick along the upper edge of the midframe, releasing the plastic clips.
Be careful when disconnecting the midframe clips — risk of damage.
Remove midi frame carefully.
When handling the rear-facing camera, be careful not to damage it.
Remove the front-facing camera using a flat-end spudger.
Be careful not to damage the motherboard.
ESD can damage circuitry, so avoid touching connectors and resistors with bare hands.
Hardware damage is possible; this process aims for the best outcome.
Use a 90% or higher alcohol solution to clean the entire board.
Do not exceed temperature greater than 150°F to avoid damage to hardware.
Power on the device after reassembling all parts.
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