LG G8 ThinQ Motherboard Replacement - LG G8 ThinQ

Unplug and power off your phone.

Insert the SIM card eject tool into the pinhole on the lower right side of the phone.
Remove the SIM card and tray.

Place the phone with the screen facing down.

Insert opening cards between the back panel and frame to loosen clips and adhesive.
Pry the back panel away from the phone using equal pressure.
Use an opening tool to fully separate the back panel once enough space is created.

Use a Phillips #000 screwdriver to remove all 14 screws holding the midframe in place.

Insert an opening tool into the gap and work your way around the perimeter of the midframe.
Pry the midframe away from the phone using a gentle rocking motion.

Remove the speaker system with an opening tool.

Disconnect the ribbon cable connecting the audio jack to the motherboard using an opening tool.

Be careful not to damage the ribbon cable.

Remove the screw holding the audio jack in place with a Phillips #000 screwdriver.
Take out the audio jack from the phone.

Flip the phone so that the screen is facing up.

Heat gun, hairdryer, or heating pad: apply heat to loosen the adhesive beneath the battery.
Be cautious not to overheat the phone, as it may cause damage to the screen and battery.
The adhesive can be stubborn; repeat the heating process multiple times if necessary.

Use an opening tool to gently pry up the ribbon cable and disconnect the battery.

or alternatively:

Use an opening tool or a credit card to carefully pry around the edges of the battery.

If you encounter resistance, reapply heat or apply isopropyl alcohol under the battery for several minutes to loosen the adhesive.

Disconnect the coaxial cables from the motherboard using a opening tool.

Use a opening tool to carefully disconnect the screen ribbon cable from the motherboard.

Next, use the same opening tool to pry up the motherboard from its frame.
Once released, remove the motherboard from the phone.