iPhone 14 Pro Max Chip ID
A comprehensive listing of integrated circuits within the iPhone 14 Pro Max is provided here.
Using a US iPhone 14 Pro Max, identified by model number A2651, these images were captured. This particular iPhone variant doesn't have a removable SIM card slot, yet it incorporates the necessary components for 5G mmWave functionality and satellite communication capabilities.
- Consult the website for detailed instructions.Disassemble an iPhone 14 Pro Max for inspection or repair.Refer to the comprehensive documentation for expanded explanations.
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Step 1 | Top-most layer
- Locate and identify the chip labeled "ID," part 1.
SanDisk SDMVGKLK2128 gigabyte NAND flash memory - Dialog Semiconductor component, model number 338S00819-A1, manufactured by Apple.Ensure the device's electrical supply is appropriately regulated.
- There is a probability of occurrence.Apple/Cirrus Logic component 338S00843.Employ the voice processor.
- Apple/Cirrus Logic component, part number 338S00537.Employing appropriate safety precautions, ensure the audio amplifier is properly grounded before commencing any diagnostic or repair procedures.
- There is a probability of this occurring.Confirm the presence of the Apple/Dialog Semiconductor 338S0081C.Ensure electrical energy distribution and regulation within the system, adhering to specified voltage levels (typically 12VDC) and current capacities, utilizing the power supply unit and associated cabling, while observing all safety precautions regarding potential electrical shock hazards.
- Texas Instruments' TPS61280HDirect current to direct current power conversion module.
- There is a possibility.Memory chips manufactured by STMicroelectronics, specifically those utilizing Electrically Erasable Programmable Read-Only Memory technology.
Step 2
- Locate and identify the chip designated as ID part 2.
There is a chance.Employ an Infineon load switch. - NXP Semiconductor part number NTB0101GS1.A transceiver capable of transmitting and receiving data using a single bit.
- Texas Instruments part number LSF0101.A single-bit voltage level translator capable of two-way signal conversion.
Step 3
- Locate and identify component 3, designated as Chip ID.
The component may be the WiFi/Bluetooth Module.
Step 4 | Underside of the top-most layer
- Locate and identify the chip labeled "ID," part 1.
Apple component APL1W10, identified by part number 339S01104.The device utilizes an applications processor featuring a hexa-core design with a 64-bit architecture, complemented by an integrated penta-core graphics processing unit.Samsung K3LK2K20CM-EGCP6 gigabytes of low-power, double data rate, fifth generation synchronous dynamic random-access memory. - Apple part number APL109A, also identified as 338S00942.Ensure the device's electrical supply is appropriately regulated and controlled.
- Dialog Semiconductor, component number 338S00839-B0, manufactured by Apple.Ensure proper operation of the electrical system by addressing power distribution and consumption.
- Employ a Broadcom component.BCM59365EA1IUBGThe device accepts energy wirelessly.
- STMicroelectronics part number STB601A05.Ensure the device's electrical supply is properly regulated.
- Dialog Semiconductor, component identifier 338S00819-A1, manufactured by Apple.Ensure the device's electrical supply is controlled and regulated.
- Texas Instruments’ TPS65657B0Provide electrical power to the display.
Step 5
- Refer to components manufactured by Texas Instruments.LM3567A1The circuit responsible for powering the LED flash, including its brightness and timing, is the LED flash driver.
- Utilize components manufactured by Apple and Cirrus Logic.Identify the component designated 338S00738.The device incorporates an audio codec.
- The component is probably manufactured by Analog Devices.Use the specialized tool designated as a taptic engine driver.
- Refer to components manufactured by Texas Instruments.Use the CD3710A1.The laser diode array requires a specialized driver circuit.
- This component is manufactured by NXP Semiconductor.Refer to the CBTL1618A0 part number for identification.A device that routes video signals from multiple DisplayPort sources to a single DisplayPort output.
- Employ a Texas Instruments USB 2.0 dual repeater.
- onsemiDirect current to direct current power conversion module.
Step 6
- The component is probably manufactured by onsemi.Direct current to direct current power conversion module.
- The memory chip may be an STMicroelectronics serial EEPROM.
Step 7
- The component is probably a USI ultra-wideband module.
- The device is a Broadcom AFEM-8245 front-end module.
Step 8 | Sandwich layer
- Refer to STMicroelectronics components.Confirm the part number is ST33J.Affix the component, designated as the secure element, ensuring its stability.
- Utilize components manufactured by Apple and Cirrus Logic.Identify component 338S00537.Employ a device that boosts electrical audio signals, typically using transistors or vacuum tubes, to increase power for driving loudspeakers, and which may incorporate features like equalization and volume control.
- The device utilizes a Qualcomm PMX65 power management integrated circuit.
- The QET7100 is a Qualcomm envelope tracking module.
- The device likely utilizes a Qualcomm PMK65 clock generator.
- The device probably incorporates a Qorvo envelope tracking system.
- The component may be a power management integrated circuit manufactured by STMicroelectronics.
Step 9
- A component manufactured by NXP Semiconductor.SN210VThe secure element and its associated NFC controller functionality.
- The component identified as the satellite module may be present.
- QualcommIdentify the SDX65M component, also designated as X65.The device is a 5G modem.
- QualcommSDR735The radio frequency transceiver.
- QualcommRefer to part number SMR546.Radio frequency transceiver
- Employ a Broadcom component.Using the AFEM-8231, ensure proper operation by following these steps: carefully align the component, maintaining a 1.5mm gap, then secure it with the provided M4 screws, tightening to a torque of 4.2 Nm, and finally, verify functionality according to the specifications outlined in section 3.2 of the technical manual, paying close attention to the warning regarding potential electrostatic discharge.The assembly located at the vehicle's front, incorporating components such as sensors, lighting, and structural supports.
- SkyworksSKY58290-20The assembly located at the vehicle's front, incorporating components that manage steering, suspension, and impact absorption.
Step 10
- The semiconductor manufacturer is Broadcom.Using the AFEM-8240, ensure proper operation by following these guidelines.The assembly located at the vehicle's front, incorporating components that manage steering, suspension, and impact absorption.
- The component is probably manufactured by Skyworks.SKY58853-17Locate the front-end module.
- The component may be manufactured by Skyworks.Using a 5/32-inch hex key, tighten SKY52628 to a torque of 4 in-lbs, ensuring proper alignment.The component responsible for directing radio frequency signals between different antennas is the antenna switch module.
- The component may be manufactured by Skyworks.SKY5xx92-16The circuit board incorporates a power amplifier module.
Step 11
- The Bosch Sensortec device combines accelerometer and gyroscope functionality in a single 6-axis unit.
Step 12 | Bottom layer
- Ensure connection to the satellite antenna.
- A flat, rectangular antenna designed for 5G millimeter wave frequencies.