Improper SIM extraction can cause irreparable damage.
Set hot air gun to adhesive melting temperature (e.g., 250°C).
Use Ethyl Alcohol (99%) to break down adhesive in seam.
Remove the back glass.
Be cautious when lifting the motherboard — risk of damage.
Be cautious: ensure the board has no power before proceeding.
When handling metal tools on the board, destat them and handle with care: no rough movements or pressure.
You may need replacement adhesive for the back housing
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