Releasing the rear glass will destroy its adhesive seal and must be replaced during reassembly.
Avoid pressing too hard, as this could damage the SIM card tray.
Locate and eject the SIM card tray.
Avoid contamination of the iOpener with debris from a dirty microwave.
Overheating may cause the iOpener to burst.
Use oven mitts or a heat-resistant glove when handling the extremely hot iOpener after microwave heating.
Heat an iOpener using boiling water if no microwave is available.
Be cautious when handling the very hot iOpener, gripping only by the end tabs.
Opening your phone will compromise its waterproof seals.
If glass is shattered, cover the panel with packing tape to hold it together during removal.
To avoid overheating, follow the iOpener instructions or use a hair dryer, heat gun, or hot plate carefully:
Apply a suction cup near the bottom edge of the rear glass.
Insert a pick along the bottom edge of the phone and slide it to cut through the adhesive.
Re-heat the rear glass as needed, or the glue may cool and harden.
Apply heat and a cutting tool to separate the glass on the other three edges.
Use a credit card or guitar pick to gently pry off any leftover glue.
Remove any remaining adhesive from the phone's chassis using tweezers.
Use high concentration isopropyl alcohol (at least 90%) and a lint-free cloth to clean adhesion areas; swipe in one direction only.
Remove thirteen 3.5mm Phillips #00 screws from the phone's midframe.
Ensure the SIM card tray is ejected.
To avoid damaging the headphone jack, remove the top of the midframe first, then push down to disengage.
If separation is difficult, heat the display adhesive with an iOpener at the edges of the display.
Lift the midframe assembly upwards to detach it from the rest of the phone.
Disconnect the battery connector from the motherboard using a flat ended spudger.
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