Replacing the rear glass will damage its adhesive seal.
Do not insert the tool into the microphone hole — risk of damage.
Clean the microwave before proceeding to prevent gunk from adhering to the iOpener.
Do not exceed 100 ̊C (212 ̊F) when heating the iOpener.
Be cautious not to overheat the iOpener and risk bursting.
Never touch the iOpener if it appears swollen.
If the iOpener remains too hot, continue using it while waiting for it to cool down and reheat as necessary.
A properly heated iOpener should stay warm for up to 10 minutes.
Use oven mitts or heat-resistant gloves to handle the extremely hot iOpener.
Use boiling water if no microwave is available.
Reheat as needed; repeat process for each use.
Opening your phone will compromise its waterproof seals.
Heating the iOpener instructions:
Use caution when applying additional heat sources: hair dryer, heat gun, or hot plate may damage OLED display and internal battery with excessive heat.
The rear glass may shatter if it's not hot enough — risk of injury.
Slide the pick along the bottom edge of the phone to slice through the adhesive securing the rear glass.
Leaving the pick in place may help prevent re-adhesion, but be prepared for it to become stuck and require removal.
Repeat the heating and cutting procedure on the remaining three sides.
Insert an opening pick to cut through residual adhesive.
Remove any remaining adhesive from the phone's chassis with tweezers.
If using old or pre-adhesive glass, follow separate guide.
Press the battery firmly towards the rear of the phone, then grasp the midframe and gently pry it away from its mounting points.
Disconnect the battery ribbon cable from the motherboard using the flat end of a spudger.
Locate and carefully disconnect the home button ribbon cable from the motherboard.
Disconnect the two antenna interconnect cables from the motherboard using the pointed end of a spudger.
Use the flat end of the spudger to gently disconnect the display ribbon cable from the motherboard.
Disconnect the earpiece ribbon cable from the motherboard.
Handle the motherboard with care as it is an ESD sensitive component.
iFixit recommends wearing an anti-static bracelet when handling components like this to prevent damage.
Avoid putting too much stress on the daughterboard ribbon cable when lifting the motherboard.
Locate and gently pull away the daughterboard ribbon cable from its connector on the underside of the motherboard.
Remove the two 2.5mm Phillips #00 screws.
Use the pointed end of the spudger to gently pry up the small section of the daughterboard that is held in place with a light adhesive.
Disconnect the daughterboard by carefully lifting it upwards from the phone's body.
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