Samsung Galaxy S25 Ultra Chip ID

The motherboard features a Qualcomm Snapdragon 8 Elite processor, an Micron MT62F1536M64D8ZA-023 WT:D module containing 12 GB of LPDDR5X SDRAM memory, and Samsung KLUEG4RHHF-F0G1 module holding 256 GB UFS 4.0 NAND flash storage.

• The battery charging system includes an Analog Devices MAX77751 USB-C charger and a Silicon Mitus SM5443 switched capacitor battery charger.
• The power management components include a Samsung S2MPBA3 module, while the audio system utilizes a Texas Instruments audio amplifier.

Identify the AMS-Osram proximity and ambient light sensor, which is likely to be faulty.

• Inspect the sensor for visible damage or corrosion.
• Use a multimeter to measure the sensor's resistance and voltage output.
• Replace the sensor if it does not respond correctly.

Be careful when handling electronic components to avoid static electricity damage.

Check the circuit board for the following components:

• Qualcomm PM8550VE-001
• Qualcomm PM8550VS-001
• Samsung S2MPB02
• STMicroelectronics wireless power transmitter/receiver
• Cirrus Logic CS40L26 haptic driver
• Texas Instruments audio amplifier

• Locate and remove the Wacom WEZ02, a key component of the device's digitizing system.
• Disconnect the Samsung S2DOS07 display power management circuitry.
• Identify and desolder the Texas Instruments SN86408 DC-DC converter module.
• Carefully disconnect the MEMS Microphone wiring harness.

The device contains a Qualcomm SDR875-004 RF transceiver, an NXP Semiconductors SN300 NFC controller with secure element, and an NXP Semiconductors SR200D ultra-wideband transceiver. Additionally, it features a Qualcomm WCN7851-101 WiFi 7 & Bluetooth 5.4 controller and a Qualcomm 5 GHz front-end module.

The device contains several sensors, including a 6-axis accelerometer and gyroscope from STMicroelectronics, a pressure sensor from Bosch Sensortec, and possibly an magnetometer from AKM Semiconductor.

• Identify the location of these sensors on the device's circuit board.
• Be careful when handling the sensor components to avoid damage or electrostatic discharge.

Damage to the sensor components can affect the device's accuracy and functionality.

Goertek MEMS Microphone: Locate and remove the device by gently prying it away from its adhesive backing.

• Flick up on the small tab to release the microphone's electrical connection.
• Carefully lift the microphone out of its mounting hole or compartment.

• Remove the Qualcomm QPM7815A-001 front-end module.
• Disconnect the Skyworks SKY58093-11 low-band front-end module from its socket.
• Identify and detach the Qualcomm front-end module.
• Remove two Murata front-end modules by carefully prying them loose with a flathead screwdriver.
• Locate and remove the Qualcomm 2.4 GHz front-end module.
• Disable the Infineon BGS12P2L6 SPDT RF switch by setting its jumper to the 'Disable' position.