Your device will lose its IP (Ingress Protection) rating and may no longer be waterproof after this repair.
This repair affects water resistance. Proper reapplication of adhesive is crucial to minimize losses, but complete protection cannot be guaranteed.
Accidental insertion of the SIM eject tool into a microphone hole will not necessarily cause damage.
Power off your phone.
Apply a suction cup near the center of the bottom edge.
Slide the pick back and forth along the bottom edge, slicing through the adhesive.
Do not remove the pick as this may cause the adhesive to reseal.
Apply heat from an iOpener to the left edge of the back cover for 2 minutes.
Insert an opening pick at the top left edge and slide it down towards the bottom left corner.
Avoid cutting past where the camera shell meets the back cover, as this may crack the plastic.
Leave the pick in place to prevent resealing of the adhesive.
Apply iOpener to the right edge of the back cover and heat for 2 minutes.
Apply a suction cup to the back of the phone, near the center of the right edge.
Pull up on the suction cup with strong, steady force to create a gap between the back cover and the frame.
Insert an opening pick into the device's right edge, moving it back and forth to separate the adhesive.
Be sure to leave the pick in place to maintain access and prevent re-adhesion.
Insert the right-edge opening pick into the top-right corner of the phone.
This procedure can be repeated for each corner except the top-left, where the rear-facing camera is located.
Slide the top-most opening pick towards the camera shell.
Heat an iOpener and apply it to the camera shell for two minutes.
Rotate the back cover counterclockwise to create a gap.
If this method fails, proceed to the next step; otherwise, skip it.
Insert an opening pick between the camera shell and frame.
Multiple rounds of heating may be required due to a significant amount of adhesive holding the frame in place.
Align the opening pick with your phone's flash.
Be cautious not to touch the flash's metal plate, as it can feel like adhesive and cause damage.
Remove the back cover.
Power on your phone and test functions before reassembling; power down afterwards.
Remove adhesive chunks with tweezers or fingers; apply heat if necessary.
Remove the motherboard bracket using a Phillips screwdriver.
Use tweezers to carefully lift and unclip the motherboard bracket from the frame.
Do not fully remove the bracket at this time, as it remains attached to the wireless charging coil.
Careful not to damage surrounding components or the socket.
Do not press down on the middle; if misaligned, pins can bend causing permanent damage.
Hold the motherboard bracket aside.
Remove the screws holding the loudspeaker in place using a Phillips screwdriver.
Insert the point of a spudger into the notch in the top-left corner of the loudspeaker.
Disconnect and remove the wireless charging coil.
Insert the flat edge of a spudger into the primary interconnect cable's press connector.
Remove both cables using tweezers or your fingers.
Remove the three screws (each 3.5 mm long) from the daughterboard using a Phillips screwdriver.
If you encounter resistance, check if the USB-C port is still caught in its groove. Gently wiggle the daughterboard while pulling until it separates completely.
Enter your pincode to see if Cash on Delivery is available in your area.