Careful handling is crucial as camera module removal can be delicate, potentially causing damage to the module itself.
Unplug and power off your phone before proceeding.
Apply a suction cup to the phone's back near the center of the bottom edge.
Pull on the suction cup with steady force to create a gap between the back cover and frame.
Due to tight tolerances, it may take multiple attempts to separate the components successfully.
Do not use excessive force with the pick, as this can crack the back cover glass.
Slide the pick back and forth along the bottom edge to slice through the adhesive.
Avoid cutting near corners where the glass is curved, as this may crack the glass panel.
Apply a iOpener to the left edge of the back cover and heat it for 2 minutes.
Attach a suction cup to the left edge of the phone's back, centered as possible.
Be prepared to make multiple attempts due to tight tolerances.
Avoid applying excessive force with the pick, which may crack the back cover glass.
Adjust the pick so its tip is directly under the glass's edge.
Tilt the pick downwards and push further to release the back cover's adhesive.
Slide a picking tool along the phone's left edge to separate the back cover.
Be cautious when sliding across the volume and power button frame, as cracking may occur at the glass cutout.
Be cautious when applying external heat as it can cause damage to the display and internal battery.
Apply a suction cup to the phone's back, as close to the right edge center as possible.
If one or more picks are released and fall out, set them aside as they will not be needed at the bottom edge.
Apply a iOpener to the top edge of the back cover and heat for 2 minutes.
The curved glass near the corners of the back cover is prone to cracking.
Remove the back cover by lifting it slowly and using opening picks to separate any remaining adhesive.
Remove the motherboard bracket using a Phillips #00 screwdriver.
Do not touch electrical components.
Peel away the wireless charging coil from the device.
Failure to properly reattach the motherboard bracket may result in improper alignment and damage.
During reassembly, refasten the motherboard bracket screws first to align the charging coil. Then firmly press the coil into place.
Careful not to dislodge small components when disconnecting.
Remove the upper midframe using a Phillips #00 screwdriver.
Locate the upper midframe's notch on the right side.
Careful alignment is crucial when re-attaching connectors to prevent pin bending and permanent damage.
Soak the area around the front-facing camera module with high-concentration (over 90%) isopropyl alcohol, allowing it to seep between the adhesive.
The camera module is heavily cemented in place and may require cutting the adhesive for removal.
Prying only the internal components without removing the casing may damage the module.
For reassembly, you can reuse the existing adhesive or replace it with a pre-cut sheet.
Apply isopropyl alcohol (over 90% concentration) around the edges of the camera module casing.
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