Familiarize yourself with the repair procedure and the necessary tools before starting work on your device.
Insert a SIM eject tool, SIM eject bit, or straightened paperclip into the small hole in the SIM card tray at the top of the phone.
Push the S-Pen button using your fingernail until it clicks.
Cracked glass back: cover entire surface with packing tape carefully.
Avoid overheating: follow iOpener instructions or use alternative heat sources carefully (hair dryer, heat gun, or hot plate).
Rear glass is fragile, avoid using excessive force or metal tools.
Do not pry with metal tools – risk of glass breakage.
Insert an opening pick under the rear glass while lifting on the suction cup.
Reheat the edge with an iOpener for 1 additional minute.
Slide a pick down the phone's bottom edge.
Leave the pick in place to prevent adhesive from resealing. Then, grab a second pick for the next step.
Glass is particularly vulnerable to cracking at curved edges.
Apply a heated iOpener to the long edge.
Continue with the heating and cutting process on the remaining three sides of the phone.
Insert an opening pick into a corner and gently pry away any remaining adhesive from the glass edge.
Use tweezers to remove remaining adhesive from both the back cover and phone's chassis.
Using high-bond double-sided tape (e.g., Tesa 61395) may leave gaps vulnerable to liquid intrusion.
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