iPhone XR Teardown

• Although the external appearance of the iPhone XR might vary, its internal specifications largely resemble previous models.
• Powering the device is a Hexa-core A12 Bionic System on a Chip, incorporating a next-generation Neural Engine.A 6.1-inch Liquid Retina LCD screen presents a resolution of 1792 x 828 pixels, achieving a pixel density of 326 ppi, alongside True Tone and wide color (P3) gamut compatibility.The rear camera features a 12-megapixel sensor with an ƒ/1.8 aperture and Optical Image Stabilization (OIS), complemented by a 7-megapixel front-facing camera integrated with TrueDepth FaceID hardware.
• Internal storage options include 64 GB, with 128 GB and 256 GB configurations also available.
• The device supports a wide range of cellular frequencies, incorporates eSIM functionality, and provides 802.11a/b/g/n/ac Wi-Fi with MIMO, Bluetooth 5.0, and NFC capabilities.The iPhone XR maintains an IP67 rating, signifying resistance to dust and water ingress.The internal architecture utilizes a Hexa-core A12 Bionic chip to manage processing tasks.
• The Neural Engine enhances machine learning performance within the device.The Liquid Retina LCD display delivers a sharp visual experience with its high pixel density.The ƒ/1.8 aperture on the rear camera allows for greater light capture.Optical Image Stabilization (OIS) minimizes blur in captured images.TrueDepth FaceID hardware enables secure facial recognition for authentication.
• The eSIM capability expands cellular connectivity options.
• Bluetooth 5.0 offers improved wireless communication compared to earlier versions.

Although a wide spectrum of hues was available, a preference for blue and black was observed.

The aesthetic qualities of the exterior finish become largely irrelevant given the ability to visually inspect the internal components, as demonstrated by Creative Electron's utilization of X-ray technology to reveal the iPhone's internal structure.

To highlight distinctions, a comparative assessment of the XR and XS models is performed, observing their variances.

• Beginning the evaluation at the lower perimeter, the XR's absence of an antenna band and the presence of uniformly spaced grille structures evoke similarities to the preceding X model.
• Although the XR shares numerous characteristics with the XS series, it lacks the high-speed gigabit-LTE functionality.
• Upon activating the screens, a noticeable difference in bezel size is apparent on the XR, and closer inspection reveals slight imperfections in the curvature.
• While the XR incorporates several features from the XS, its camera configuration is limited to a single wide-angle lens, as the telephoto lens remains exclusive to the XS.

The initial disassembly mirrors the XS model, featuring pentalobe fasteners encircling the charging connector, which is no longer precisely centered, and requiring minimal assistance from an iOpener to separate the enclosure.

• Notable distinctions involve the use of pentalobe screws that do not match the device's color scheme, and a repositioned SIM card tray located closer to the phone's lower edge.
• A perplexing variation is the apparent absence of a difference in enclosure opening resistance between the XR and XS, as the XR exhibits a comparable level of difficulty to open.

The initial display-oriented process concludes swiftly, presenting a remarkably straightforward experience for a device with water resistance.

• Apple initially implemented this structural approach with the iPhone 5, and this design has remained consistent throughout subsequent models.

The internal components of the XR exhibit characteristics of both the iPhone 8 and iPhone X, notably featuring a rectangular battery alongside a similarly shaped logic board.

Determining the number of stacked layers comprising the logic board is the key inquiry.

Numerous standoff screws obstruct the logic board's removal process, a significantly higher quantity than the typical one or two found in previous iPhone models.

• We possess the necessary tools and preparations to proceed with the repair.

A noteworthy discovery is the presence of a modular SIM card reader, a first for iPhone devices.

• The design facilitates rapid SIM reader replacements and minimizes logic board replacement expenses, offering substantial advantages.

This design choice likely accommodates the requirements of the Chinese market, where eSIM technology is unavailable; Apple incorporates a dual Nano-SIM reader into Chinese models to provide dual-SIM capabilities, a simpler implementation compared to soldered designs of earlier iPhones.

The streamlined, flat logic board can now be completely detached from the device.

Removing the logic board provides initial visibility of the integrated circuitry.

• The system-on-a-chip is identified as an Apple APL1W81 A12 Bionic SoC.
• A 3 GB LPDDR4x SDRAM module, specifically a Micron MT53D384M64D4SB-046 XT:E, is situated atop the SoC.
• The component designated as Apple/USI 339S00580 appears to function as a WiFi and Bluetooth module, mirroring designs utilized in the XS.
• An NFC controller from NXP Semiconductor, model SN100V, is present on the board.
• Three audio amplifiers, each bearing the Apple/Cirrus Logic part number 338S00411, are incorporated into the design.
• A Skyworks 203-15 G67407 1838, presumed to be a power amplification module, is also observed.
• The USB Type-C port is managed by an Infineon (formerly Cypress Semiconductor) CYPD2104 controller.
• A Qorvo QM76018 RF Front End Module handles radio frequency operations.

Numerous additional chips are present on the rear surface of the main circuit board; verification of your identity is required.

• The device incorporates a 64 GB flash memory module manufactured by Toshiba, identified as TSB3243VC0428CHNA1.
• Critical components include an Intel PMB9955 processor (potentially the XMM7560 LTE Advanced Pro 4G LTE baseband processor), an RF transceiver designated PMB5762, and a PMB5829 component.
• Power management functionality is provided by Apple 338S00383-A0 and 338S00375-A1 integrated circuits, which are likely sourced from Dialog Systems.
• Battery charging operations are controlled by a Texas Instruments SN2600B1 integrated circuit.
• Audio processing is managed by an Apple/Cirrus Logic 338S00248 audio codec.
• The Skyworks SKY13768 serves as the front-end module for radio frequency signals.
• Wireless power reception is facilitated by a Broadcom BCM59355A2IUB4G chip, which appears to be a derivative of the BCM59350.

The integrated circuit is being identified, continuing the process.

• Components from Texas Instruments are present.A Texas Instruments LM3539 is incorporated, functioning as a backlight driver.The circuit utilizes an NXP Semiconductor CBTL161x.
• An NXP Semiconductor CBTL161x serves as a display port multiplexer, a probable function.STMicroelectronics provides the STB601A0.The STB601A0 is responsible for power management functions.
• Another component originates from Texas Instruments.A Texas Instruments TPS65730 manages display power.The TPS65730 is a dedicated display power management solution.
• Texas Instruments also supplies an LED driver.The LED driver's role is likely specific.Bosch Sensortec contributes a BMP282.
• The BMP282 is a pressure sensor.Additionally, a Bosch Sensortec accelerometer is included.The accelerometer's purpose is to detect motion and orientation.
• The LM3539 facilitates illumination control.The CBTL161x manages display signal routing.The STB601A0 regulates electrical power distribution.
• The TPS65730 provides regulated voltage for the display panel.

Following the logic board discussion, two additional logic boards are presented.The redesigned XR board incorporating the SIM reader (positioned centrally) exhibits a resemblance to an unfolded iPhone X logic board (located on the right), with the expansive iPhone 8 Plus logic board displayed on the left for comparative analysis.
The updated design effectively bridges a developmental stage in the progression of iPhone logic board architectures.
X-ray imaging provides a detailed view, highlighting that this "streamlined" iPhone logic board maintains a significant level of intricacy.
Further integrated circuitry remains concealed under other installed components, such as the TrueDepth camera assembly.

Following the logic board's removal, proceed to extract the Taptic Engine.Despite the XR model lacking 3D Touch functionality, it incorporates Haptic Touch, functionally equivalent to a sustained touch interaction, powered by a linear oscillating vibration motor.
The battery, a rectangular component, is then removed, benefiting from the presence of four adhesive pull tabs simplifying the extraction process.
The Taptic Engine's haptic feedback is generated by a standard linear-oscillating vibration motor, similar to those found in other devices.

The procedure now advances to step 12.Each of the four retaining tabs functioned effectively during the disassembly process.The battery, exhibiting a capacity of 11.16 Wh, was successfully extracted without any adhesive residue.The iPhone XR's battery performance is now evaluated against previous models.
A comparative assessment of battery capacities across several iPhone generations is about to commence.
Arranged sequentially, the iPhone 8 possesses a 6.96 Wh capacity.The iPhone XR demonstrates a superior battery capacity, achieving a value of 11.16 Wh.The iPhone 8 Plus exhibits a 10.28 Wh capacity.The iPhone XS demonstrates a 10.13 Wh capacity.Despite its apparent smaller size, the XR battery's increased thickness allows for a greater energy density.When contrasted with Android devices, the Galaxy S9+ maintains a lead in overall battery capacity, boasting 13.48 Wh.The Pixel 3 XL closely follows the Galaxy S9+, with a capacity of 13.2 Wh.
A detailed examination of the internal components of the iPhone X, XR, and XS Max is now performed using radiographic imaging.
The iPhone X's internal structure is now visible.The XR's construction incorporates a less dense aluminum frame.The XS Max's internal components are now visible.Radiographic analysis provides insight into the internal design of these devices.The differing frame materials impact the overall device density.
These X-ray images provide a visual comparison of the internal components.

The procedure now involves the solitary rear camera, a revised wide-angle component shared with the XS and XS Max models.Although the single-sensor XR presents a potential rival to Google's Pixel 3, which also utilizes a single camera, Google's device surprisingly outperforms even the XS Max's dual-camera system.

• Addressing this performance gap might necessitate incorporating additional camera modules.
• The camera's alignment is performed relative to the TrueDepth system responsible for FaceID functionality, which appears structurally identical to its initial implementation in the iPhone X.

Following camera positioning, attention shifts to the lower speaker, which retains its straightforward removal process—a beneficial attribute considering its likely displacement during battery replacement.
Facilitating subsequent steps, the lower speaker's ease of removal remains consistent, proving advantageous for procedures like battery swaps.

The subsequent procedure focuses on the Apple-designed Liquid Retina display.The Liquid Retina display, a subject of considerable discussion, is now the focus of our attention.

• The XR's LCD panel exhibits a 0.3-inch increase in width compared to the XS's AMOLED screen, accompanied by increased thickness and weight, a characteristic of LCD technology.
• The requirement for a backlight inherently dictates that LCD display assemblies will possess a greater physical dimension than comparable AMOLED assemblies.
• Our assessment indicates that this increased display thickness is the primary reason for the Lightning connector's shifted position.

Re-entering the device enclosure, the wireless charging coil is extracted for detailed examination.
The presence of copper has been confirmed; its reduced electrical resistance, in contrast to the FPC found in the X, is anticipated to facilitate faster charging while minimizing heat generation.

The complete removal of the XR chassis allows for examination of its internal components.Observations from the disassembly process are presented to highlight key design elements.

• Internal architecture exhibits characteristics of earlier iPhone models, specifically the iPhone 8 (identified by a rectangular battery and single-layer circuit board) and the iPhone X (distinguished by a near-square logic board and Face ID functionality), leading to its designation as a conceptual 'iPhone 9'.
• Despite its design similarities to past models, the XR incorporates contemporary processor technology and introduces novel iPhone features, including Apple's initial modular SIM card reader, potentially intended to support multiple SIM card subscriptions.

We extend our gratitude to Creative Electron for their invaluable assistance throughout this process.
A humorous query concludes this guide: 'What is a pirate's preferred iPhone model?' with the playful response, 'The X-ARRRrrrrr'.