Fix unresponsive iPhone X

Prior to commencing any repair work, it is essential to disconnect the device from all electrical power supplies.

Consult the device's user manual for detailed information pertaining to your specific model and any supplementary safety guidelines.

Navigate to the Settings menu, then select Sounds & Haptics.
If everything functions correctly, proceed.
While the display remains active, initiate a phone call utilizing a verified functional phone; the decline and answer buttons should become visible on the screen.
Deactivate the display, then make a call using a confirmed working phone. If the device exhibits a complete lack of response, engage the power button to reactivate the screen, at which point the decline and answer buttons should be observable.

The baseband wake signal's underlying circuitry may be experiencing operational failures, based on the observed behavior.
Disassemble the device, beginning with battery disconnection. Subsequently, remove the display unit and extract the motherboard.
Secure the motherboard to the PCB Holder for stability.Utilize aHot Air Gun, maintaining a temperature of 200°C and an airflow rate of 3.
Carefully peel away the thermal dissipation sticker adhered to the rear surface of the motherboard.
Initiate the bitmap software application and identify the signal labeledBB_TO_PMU_PCIE_HOST_WAKE_LGiven the possibility of failures within the wake signal's associated circuits, an alternative approach involves sourcing the wake signal from the WiFi circuitry.
Similarly, locate the signal designatedWLAN_TO_PMU_HOST_WAKETo facilitate troubleshooting, a temporary connection can be established betweenPP101_E-1 (the designated test point for the baseband wake signal) andPP7611_W-1 (the designated test point for the WiFi wake signal) via a wire jumper.

Begin by removing the insulating material covering the designated test locations. Subsequently, deposit solder paste onto the two bonding areas. Utilize a Soldering Iron, maintaining a temperature of 365°C, to facilitate the process. Apply solder paste to the bonding pads to ensure they are properly tinned.Soldering Iron at 365°C
Establish a connection betweenPP101_E-1andPP7611_W-1using 0.02mm Enameled Copper Wire.

Apply a layer of UV-curable solder mask to the exposed wire to provide insulation and protection.
Proceed with reassembling the mobile device and initiating a series of tests; initially, verify functionality with the display deactivated, and subsequently, if all tests conclude successfully, the identified fault has been resolved.