iPhone SE 2020 Teardown

• The device incorporates an A13 Bionic system-on-a-chip, featuring a third-generation Neural Engine, directly sourced from the iPhone 11, 11 Pro, and 11 Pro Max models.
• A 4.7-inch Retina HD screen, boasting a resolution of 1334 × 750 pixels (resulting in a pixel density of 326 ppi), along with True Tone technology and P3 wide color gamut capabilities, is present – mirroring the features of the iPhone 8.
• The rear camera is a 12-megapixel wide-angle lens with an ƒ/1.8 aperture, complemented by a 7-megapixel front-facing camera with an ƒ/2.2 aperture; these components are believed to have originated from either the iPhone 8 or the iPhone XR.
• Connectivity includes Gigabit-class LTE with 2x2 MIMO antenna configuration, 802.11ax Wi-Fi 6 with 2x2 MIMO, Bluetooth 5.0, and Near Field Communication (NFC) – all features previously seen in the iPhone 11.
• A physical Home button, equipped with a second-generation Touch ID sensor, makes a return, reminiscent of the iPhone 8.
• The device achieves an IP67 rating for resistance against dust and water, a welcome addition at this price level, although not directly inherited from any specific iPhone model.

• Although the newer SE model exhibits a larger physical size, the 2016 SE model decisively prevails in the availability of a standard 3.5mm headphone jack.
• This device has been described as a black-colored iPhone 8 incorporating the internal components of a green iPhone 11; we will investigate this assertion.
• While the new SE's dimensions are marginally smaller than those of the 11 Pro, the noticeable distinction lies in their weight, with the SE being 21% less massive than the 11 Pro.

• Shortly, we will transport the device to the teardown workstation; however, initially, we are sending the SE for radiographic analysis, a service provided by our collaborators at Creative Electron, alongside its earlier iterations, the original SE (positioned on the left) and the iPhone 8 (located in the center).
• Should you identify significant internal variations compared to the iPhone 8, your visual acuity surpasses our own; beyond minor antenna modifications and repositioning of certain components on the logic board, the specific alterations implemented by Apple remain unclear to us.
• Our anticipation was for modifications to the antenna configuration to support the enhanced gigabit LTE (MIMO) and/or Wi-Fi 6 capabilities; the frame discontinuities observed on the iPhone XS were quite distinct from those on the X, a contrast not seen with the SE and 8.

• To provide a more comprehensive demonstration, we will open two iPhones simultaneously, continuing the comparison with the iPhone 8 to highlight their shared characteristics.
• Should the observed resemblances extend beyond mere aesthetics, it may become feasible to utilize iPhone 8 components to repair an iPhone SE, or conversely, enabling a wider range of repair options.
• The availability of parts that function across different iPhone models could significantly benefit independent repair services, especially given the increasing unpredictability of original equipment manufacturer (OEM) repairs.

• Consequently, this compatibility simplifies the sourcing of replacement parts and reduces costs, benefiting all involved parties.

• Following the discontinuation of 3D Touch functionality in the iPhone 11 Pro series, Apple implemented a reduction in display thickness and a corresponding increase in battery thickness.
• The new SE also omits 3D Touch, but maintains the same physical dimensions for its battery.

• Likely a cost-saving measure to achieve the target retail price of $399.
• Another possibility: Apple intends to phase out consumer awareness of 3D Touch technology; we acknowledge its prior existence.

The primary camera unexpectedly detaches. Its origin is uncertain, with speculation pointing to the iPhone 8, the XR, or an entirely different model. This divergence of possibilities necessitates a definitive comparison through a direct examination.

Regardless of its precise source, the iPhone SE's image sensor exhibits a smaller physical size compared to the XR's. It is likely a sensor from the iPhone 8, enhanced by the A13's image processing capabilities.
Detailed insights into the A13's innovative techniques for enabling Portrait Mode photography on the iPhone SE can be found in Halide's most recent blog post.
As a final note, our evaluations confirm that the iPhone 8 camera functions correctly within the SE, and the reverse is also true.

Imagine a scenario where you're repairing a mobile device in complete solitude, limited to a single tool; what would you select?
Selecting "a Pro Tech Toolkit" demonstrates commendable judgment, and warrants a congratulatory gesture, maintaining a safe distance of approximately 1.8 meters.
Occasionally, during iPhone disassembly processes, we encounter unexpected component configurations, as exemplified by this particular device.
Actually, there are two such boards present. The one featuring the exceptionally rapidA13 chipis associated with the SE model; however, it appears to have been installed in reverse orientation. Let's investigate further and identify any additional anomalies on this board.

Let's delve into the internal components:

• The Apple APL1W85, an A13 Bionic System on a Chip, is present.Multiple layers are situated atop one another.A Samsung K3UH4H40BM-SGCL memory chip, likely providing 3 GB of LPDDR4X RAM, is also found.
• An Avago 8100 PAMiD (Power Amplifier Module with Integrated Duplexer) handles mid and high frequency bands.
• The device incorporates an Intel PMB9960 P10PSV modem.
• A Skyworks 78223-17 power amplifier module is included.
• The Skyworks 78221-17 manages the low-band PAMiD functionality.
• A Cypress CPD2104B integrated circuit regulates USB power delivery.
• An Apple/Cirrus Logic 338S00295/CS35L26 audio amplifier is also present.

The following components are designated as Secondary Elements:

• The specific model number of this component is Toshiba TSB4226LF23417WNA11948.This device incorporates 64 GB of flash memory for data storage.
• The part identified as Apple APL1092 is present within the system.A power management integrated circuit is utilized for regulating electrical flow.
• The component labeled USI 339S00648 serves a specific function within the device.A system-on-chip integrates WiFi and Bluetooth communication capabilities.
• The Broadcom 59358A81UB56 component is utilized in the device's design.A touch controller manages input from the device's touch-sensitive surface.
• The Apple/Cirrus Logic 338S00295/CS35L26 component is incorporated into the system.An audio amplifier boosts the audio signal for output.
• The Apple/Cirrus Logic 338S00248/CS42L75 component is part of the device's circuitry.An audio codec converts analog audio signals to digital and vice versa.
• The Texas Instruments SN2501 component is present.A USB charge controller manages the charging process for USB devices.

Furthermore:

• The STMicroelectronics ST33G1M2 is present.This component is a 32-bit ARM secure microcontroller.
• An Intel PMB6840 is also included.This part functions as a power management solution.
• The system incorporates an Intel PMB5765.This device serves as an RF transceiver.
• A Qorvo F706ZXL is utilized.This component provides envelope tracking functionality.
• The Texas Instruments TPS65730 is integrated.This part handles display power management.
• A Power Integrations LXA01S is incorporated into the design.
• The NXP Semiconductor NXP1612A1 is also present.A display driver, the specific model is currently undetermined, is included.

Returning to the 3D Touch-less display, we anticipated a minor, yet quantifiable, reduction in thickness; however, the visual difference is not apparent from this perspective. The iPhone 8 display (positioned on the left) presents a remarkably similar appearance to the SE's (located on the right). One might question if they share identical components.
However, a closer examination is warranted! In displays incorporating 3D Touch functionality, a dedicated chip is typically present on the rear side, responsible for operating the parallel plate capacitors—a feature observed during our 6S teardown. The iPhone SE display (visible on the right within this photograph) lacks this chip, instead exhibiting an empty space where the chip would normally reside.
To ascertain the presence of the capacitor layer, we began the process of carefully removing display components...
Verification confirms the absence of 3D Touch capabilities.
Fortunately, these two displays are functionally compatible, a noteworthy observation given the substantial differences in their underlying hardware; the 8 display operates correctly within the SE, and the reverse is also true.
Despite this interchangeability, attempts to integrate 3D Touch functionality into a new iPhone SE proved unsuccessful.

A different viewpoint regarding the latest SE model is presented.

Returning to the design era of 2017 evokes a strong sense of familiarity.

• A comprehensive inventory of components that function with the iPhone 8 can be found on our parts testing blog post.
• We are delighted that Apple assembled this device utilizing components from prior generations; this approach should simplify the acquisition of replacement parts and minimizes waste through the continued use of established production processes.
• Although Apple was not obligated to incorporate their most recent A13 Bionic chip into the SE, they did so, ensuring the device's longevity for a considerable period.

Prior to finalizing our assessment, we are pleased to announce the recipient of our iPhone SE 2020 giveaway; applause for Elliott Kinsey!

We will confirm shipment of the additional iPhone that was procured, rather than the unit that we disassembled… most likely.