iPhone 8 Teardown

• The8Incorporating innovative features, does this device justify its higher price point? Consider the following:
• It utilizes an A11 Bionic processor integrated with an M11 motion coprocessor.
• Internal storage options include either 64 or 256 gigabytes.
• A 4.7-inch IPS multitouch Retina HD display, boasting a resolution of 1334 × 750 pixels and a pixel density of 326 pixels per inch, is present.
• A 12-megapixel camera, featuring an ƒ/1.8 aperture, optical image stabilization, and a 5x digital zoom, is included.
• The device also features a 7-megapixel FaceTime HD camera with an ƒ/2.2 aperture and the ability to record video in 1080p HD.
• Compatibility with rapid charging and Qi wireless charging is supported.
• Wireless connectivity is provided through 802.11a/b/g/n/ac Wi-Fi with MIMO technology, alongside Bluetooth version 5.0 and NFC capabilities.

• Commencing the disassembly process, we immediately recognize a design that is becoming increasingly recognizable. Notable characteristics encompass:
• A solid-state home button, incorporating the Touch ID fingerprint sensor, is present.
• A IPS display exhibits a resemblance to the display previously observed in the iPhone 7, but now incorporates True Tone technology.
• The rear of the device showcases Apple's newly designed glass backing, characterized by a seven-layer color finish.
• Apple claims the rear panel is strengthened by an internal framework of laser-welded steel and copper; however, the long-term resilience of this construction remains to be determined through extended use and durability assessments, as it will reveal whether this phone is susceptible to cracking, popping, or a recurrence of issues similar to Bendgate.
• The definitive identification of the model number and the absence of the recycling symbol are still under investigation.

• Prior to disassembly, we utilize X-ray imaging for inspection.
  Representatives from Creative Electron visited Circuitwise and acquired high-quality preliminary images.
  The smooth rear casing reveals complex internal components; initially visible is the newly incorporated wireless charging coil.
  Further details regarding this feature will be provided subsequently; presently, we suspend X-ray analysis to formulate a repair strategy.
  The model designation is visible without requiring X-ray capabilities; it is located on the packaging, specifically the rosy gold box, and is identified as A1863.
  Apple's design philosophy prioritized a minimalist rear appearance, suggesting the absence of a traditional identification card within the SIM card tray.

• Let's begin disassembling this device. Removing the five-pointed screws is the initial step, followed by applying heat to loosen the waterproof display seals.
  An iOpener is required for this procedure.Once the seals become pliable – a process indicated by a distinct softening – proceed to the next step.The iSclack tool is then retrieved to provide leverage for separating components.Using opening picks in conjunction with the iSclack, carefully sever the adhesive bonds holding the device together.
  The sensation of familiarity during this process is not uncommon.
  The device is now fully separated, and a preliminary inspection shows no immediately apparent changes, although a more thorough examination is warranted.

• Upon accessing the book display assembly, the display cable bracket is immediately visible. Fortunately, the previously encountered tri-point screws are replaced with more accessible Phillips #000 screws.
  The tri-point screws will not be missed.
• Several connectors, specifically those for the battery, display, and home button, are swiftly disconnected, allowing for the complete removal of the display unit.
• The absence of gaskets on the display's pentalobe tabs is observed, a characteristic previously noted in the iPhone 7 model.
• Despite both the iPhone 7 and iPhone 8 possessing an IP67 rating for water resistance, the internal components remain protected.

Retrieving the battery involves grasping its stretch-release adhesive strips, revealing a quantity two greater than typically encountered.
Despite this, the task is manageable; assistance from one or two individuals allows for the simultaneous removal of all four strips.
Successful completion of this step necessitates considerable expertise, largely attributable to prior experience with Stretch Armstrong figures.
The mozzarella stick pull tabs detach without resistance, and the battery disengages with minimal effort.

With the battery pack now removed, a performance evaluation against alternative options becomes possible.
When completely charged, this 3.82 V, 1821 mAh cell is capable of providing 6.96 Wh of energy.
For a direct comparison, the iPhone 7 incorporated a 7.45 Wh power source.
As a point of reference, the Galaxy S8, which shares similar specifications, utilizes a 11.55 Wh battery.
It's important to note that, despite the reduction in capacity, Apple asserts that the battery performance will closely match that of the previous model.

To access the logic board, we must carefully remove the primary rear camera assembly.
The iPhone 8 utilizes a ƒ/1.8, 6-element lens configuration, mirroring the design found in the iPhone 7, although the remaining camera components have undergone significant enhancements.
While the iPhone 8's sensor exhibits a larger physical size compared to the iPhone 7's, it maintains a 12 MP resolution. Consequently, the individual photosensitive elements are larger, enabling greater light capture, enhanced color reproduction, and reduced image noise.
Furthermore, advancements in image processing algorithms demonstrate Apple's continued innovation in photographic technology.
Previously unseen, X-ray imaging reveals the presence of magnets positioned at the four corners of the camera module, facilitating advanced optical image stabilization (OIS) capabilities.

Proceeding further in this disassembly, we observe several unusual cables and mounting hardware.

• Initially, a replacement bracket for the Lightning port is revealed, appearing to provide structural support for the new peach-colored port and secure the Taptic Engine.
• Until this point, a Phillips screwdriver has served us well; however, its utility is now limited. During bracket removal, a tri-point screw presented itself, but it was easily managed with our 64 Bit Driver Kit.

The last obstacle preventing logical progression of the motherboard repair involves a minuscule, concealed screw, frequently discovered lodged beneath the waterproof silicone gaskets!

• Specialized tools, specifically Jumpy's, provide crucial assistance in detaching the logic board!

• Apple 339S00434, a system-on-a-chip featuring the A11 Bionic SoCis constructed with multiple layers, incorporatingan SK Hynix H9HKNNNBRMMUUR chip providing 2 GB of LPDDR4x RAM
• along with a Qualcomm MDM9655, a Snapdragon X16 LTE modem for cellular connectivity
• utilizes a Skyworks SkyOne SKY78140 component
• integrates an Avago 8072JD130
• includes a P215 730N71T, probably functioning as an envelope tracking integrated circuit
• features a Skyworks SKY77366-17, a module that amplifies GSM signals across multiple frequency bands
• incorporates an NXP Semiconductor 80V18 (PN80V), a secure module for Near Field Communication (NFC) functionality

• The component identified as Apple/USI is the 170804 339S00397 WiFi/Bluetooth module.
• Also present is an Apple/Dialog Semiconductor 338S00309 PMIC, along with a Cirrus Logic 338S00248 audio codec and a 338S00286 audio amplifier.
• A Toshiba TSBL227VC3759 64 GB NAND flash storage device is also present.
• The device incorporates a Qualcomm WTR5975 Gigabit LTE RF transceiver, paired with a PMD9655 PMIC.
• A Broadcom BCM59355, which is probably a version of the BCM59350, serves as the wireless charging integrated circuit.
• An NXP CBTL1612A1, likely a derivative of the 1610 tristar IC, is also found.
• Finally, there are Skyworks 3760 3576 1732 RF switches and a SKY762-21 247296 1734 RF switch.

• A Cypress Semiconductor component is present.The specific part number for the Cypress Semiconductor component is CYPD2104C.This Cypress Semiconductor component functions as a USB type-C port controller.
• A Texas Instruments device is also incorporated.The Texas Instruments component's part number is SN2501.The SN2501 serves as a charger for a lithium-ion battery.
• Another Texas Instruments component is utilized.The Texas Instruments component identified is the SN61280E.The SN61280E performs the role of a battery boost converter.
• A further Texas Instruments device is included in the design.The Texas Instruments component is designated as the LM3539.The LM3539 is responsible for controlling the LED driver circuitry.
• A component from Texas Instruments is also present.The Texas Instruments component is identified as the TPS65730.The TPS65730 likely manages power for the display, though confirmation is pending.
• A Bosch Sensortec accelerometer and gyroscope are integrated.
• A Bosch Sensortec BMPxxx series component is present, likely functioning as a pressure sensor.

• Previously documented, this barometric vent enables the iPhone to precisely determine altitude and simultaneously preserve a waterproof enclosure.
• Apple claims the speakers produce a sound output that is 25% greater in volume compared to earlier models, although the perceptible difference is subject to varying opinions.
• Identical to the iPhone 7, this iPhone 8 also possesses twelve speaker apertures arranged in a circular pattern along the bottom edge.
• Consistent with previous designs, waterproofing is maintained through the presence of seals and small rubber gaskets.

• The coil functions by producing an oscillating magnetic field, which subsequently generates an alternating electrical current; this alternating current is then transformed into direct current, providing the power necessary to charge the battery.

• The fragility of the glass was unexpected, contradicting Apple's claims regarding its enhanced strength.
• The procedure resulted in a noticeable deformation of the backing plate; the method Apple employs for this repair remains unknown, and appears to be deliberately concealed.
• The adhesive residue observed on the surface is not the result of any recreational activities involving mollusks; it is, instead, a substantial quantity of adhesive.

• Now, our focus returns to the familiar display, where we will carefully detach the remaining components.
• Farewell,home button.
• We bid adieu to the front-facing sensor cable.
• The LCD shield is now removed.
• However, an unidentified small chip remains.
• The light sensor is shielded by a tinted filter, seemingly contributing to the functionality of theTrue Tone system.

• This concludes the current installment; however, additional content, including textual explanations and visual aids, will be released over the coming days.
• Our sincere gratitude goes toCircuitwise for generously allowing us to utilize their exceptional facility located in Sydney; we strongly encourage you to view their impressive demonstration of soldering techniques.
• We also extend our appreciation to theCreative Electron personnel for their substantial assistance with X-ray imaging.