iPhone 7 Plus Teardown

• The device utilizes an Apple A10 Fusion processor.This processor incorporates an integrated M10 motion coprocessor.
• Storage options include onboard capacities of 32, 128, and 256 gigabytes.Please note that the jet black model is unavailable with a 32-gigabyte storage configuration.
• A 5.5-inch multitouch IPS Retina HD display is present.This display offers a resolution of 1920 by 1080 pixels, resulting in a pixel density of 401 pixels per inch.
• The device features a dual 12-megapixel camera system, comprising a wide-angle and a telephoto lens.These cameras have apertures of f/1.8 and f/2.8, respectively, and provide 2x optical zoom and 10x digital zoom capabilities.
• A 7-megapixel FaceTime HD camera is also included.This front-facing camera has an aperture of f/2.2 and supports 1080p HD video recording.
• The Home button is a solid-state component that incorporates Touch ID functionality, powered by a new Taptic Engine.
• Wireless connectivity includes 802.11a/b/g/n/ac Wi-Fi with MIMO, Bluetooth 4.2, and NFC.

• The iPhone 7 Plus maintains the same physical size as the previous model, measuring 158.2 mm × 77.9 mm × 7.3 mm—though a slight reduction in weight results in a total of 6.63 oz (compared to the 6s Plus's 6.77 oz). It is hoped that this weight reduction did not compromise any essential components.
• A new model identifier, A1785 is now marked on the device.
• Apple has expanded the color options for the iPhone 7 Plus to include a matte black and a jet black finish, which is prone to scratches, alongside the existing silver, gold, and rose gold.
• The design incorporates a more understated aesthetic by eliminating the prominent antenna lines previously seen on earlier models.
• A notable inclusion is the Lightning to 3.5 mm headphone jack adapter provided within the product packaging; transitioning away from the traditional headphone jack will require adjustment. This adapter is not at fault for the change.

• To begin our exploration of this device, we present a preliminary look, provided by Creative Electron, offering a glimpse inside.
• Additional internal views of the new iPhone will be forthcoming, thanks to our specialists utilizing X-ray technology!
• What benefits are realized through the capability of X-ray imaging?
• Initially, it is apparent that the headphone jack has been relocated to create additional room for a Taptic Engine.
• A more detailed examination reveals a novel, secondary lower speaker grille that appears to connect... to nothing; a curious detail.
• Furthermore, the new third camera lens is visible within the camera assembly of the iPhone 7 Plus. What capabilities and insights does this component offer? Let's investigate!

• Although Apple eliminated the standard 3.5mm headphone connector, the Pentalobe screws remain a fixture, with two securing each side of the Lightning port.
• Driven by curiosity to examine the internal components, we apply significant pressure and leverage to overcome the robust adhesive securing the chassis.
• The adhesive used to seal the 7 Plus exhibits a substantially greater bonding strength compared to the adhesive encountered in the previous model; might this indicate an initial indication of water resistance?

• An unexpected configuration is observed; the 7 Plus unexpectedly splits open laterally, even though it retains the standard clips located at the phone's upper edge, which are used for display alignment, mirroring designs from earlier iterations.
• Fortunately, we avoided damaging the display connectors situated along the middle-right edge; the upper cable possesses sufficient play.
• These minor alterations in design highlight the utility of detailed repair documentation.
• Disassembly of the 7 Plus exposes extensive quantities of black and white adhesive material distributed around the phone's outer boundary.
• We hypothesize that this adhesive, resembling a penguin's coloration, is incorporated by Apple to enhance water resistance; alternatively, Apple's engineering team may simply have a strong affinity for adhesives.

• Within this area, a significant number of robust tri-point screws protect the cable bracket, which shields the battery connector and two display cable connections.
• Previously, we incorporated the Apple Watch screw driver into our 64-bit toolkit, a decision that has proven exceptionally beneficial.
• A separate group of tri-point screws fastens the bracket that secures the lengthy, flexible upper component display cable.
• Tri-point screws are not frequently encountered; although one might suggest they are less prone to damage, it is evident that their presence is primarily intended to complicate the most frequent user repairs, namely battery and screen replacements, rather than offering a mechanical advantage.
• Employing a screwdriver, we remove the bracket, allowing us to proceed further into the iPhone 7 Plus.

• Located where the headphone jack previously resided is a part that appears to direct audio from the external environment towards the microphone, or potentially from the Taptic Engine.
• This component lacks complex electronic circuitry, instead relying on carefully engineered acoustic design and molded plastic construction.
• Teardown Progress Report:Apple's documentation identifies this plastic element as a barometric vent; the watertight seal's enhanced protection allows the iPhone to utilize this component to maintain equal internal and atmospheric pressure, which is essential for precise altimeter readings.
• The traditional mechanical button has been eliminated, replaced by the Taptic Engine, which generates simulated button presses through haptic feedback, negating the need for a physical button.
• Individuals acquainted with the touchpad found in the 2015 Retina MacBook will already be familiar with the haptic sensations produced by the Taptic Engine.

• Experiencing instability necessitates a thorough diagnostic assessment of all dynamic components; consequently, we performed a detailed examination of the Taptic Engine's functionality.
• Taptic EngineIts operation resembles that of a complex device from a futuristic spacecraft; however, the mechanism fundamentally involves a miniature linear actuator coupled with angled springs that induce oscillations in a weighted core.
• Considering the complexity of its internal workings, this component represents the most substantial mechanical assembly encountered within a smartphone.
• The Taptic Engine converts the force applied to the new solid-state home button into precisely regulated vibrations.
• The satisfying feel of a button press is universally appreciated; therefore, the Taptic Engine's carefully calibrated oscillations are intended to replicate diverse tactile sensations, including the impression of engaging a conventional mechanical button.
• The question arises: why not simply incorporate haptic feedback into a standard button, similar to the iPhone 6s? The primary reason is to eliminate a potential ingress point for water.

• Each of the three adhesive release tabs is carefully extended to disengage the battery.
• Concerns regarding challenging battery separation are now resolved.

• The battery's nominal voltage is3.82 Vand its capacity is2900 mAh, resulting in a total energy capacity of11.1 Wh.
• This represents a modest improvement compared to the10.45 Wh (3.8 V, 2750 mAh) found within the 6s Plus.
• Its energy capacity aligns with the11.1 Wh, 2915 mAh cell utilized in the 6 Plus.

Apple anticipates an extended battery lifespan, potentially adding up to one hour compared to the 6s Plus—specifically,21 hours of 3G cellular communication, roughly15 hours of wireless internet browsing, or as much as16 days in a standby state.

• Detach the camera assembly with meticulous care; this component incorporates two distinct sensors, a dual lens configuration, and two electrical connectors.

Each camera utilizes a revised image sensor, which Apple asserts offers 60% increased processing speedand30% greater power efficiencycompared to earlier iPhone models. The enhanced photographic features largely compensate for the increased external protrusion, now structurally integrated into the device’s housing, potentially as part of a design intended to provide waterproofing and dust resistance.

Employing advanced diagnostic techniques, we identify four metallic contact points surrounding one camera, presumably containing the magnets facilitating OIS operation. Furthermore, the presence of the Analog Devices AD5842 OIS driver is also noted.

• Separating the logic board from the rear case necessitates preliminary disconnection of antenna assembly components, specifically the antenna flex cable.

• The process of detaching the main circuit board from the iPhone 7 Plus presents a more straightforward experience compared to earlier models, as it eliminates the requirement to rotate the board to sever the last set of connections.
• Upon removing the electromagnetic interference (EMI) stickers, we observe what appear to be supplementary heat dissipation components, potentially related to the A10 system-on-chip.

• The circuit board is now prepared for detailed examination; the following components are visible:
  • An Apple A10 Fusion APL1W24 System-on-Chip is present.Additionally, we observea Samsung 3 GB LPDDR4 RAM module, identified by the marking K3RG4G40MM-YGCH.
  • A Qualcomm MDM9645M LTE Cat. 12 Modem is also present.
  • The device incorporates a Skyworks SKY78100-20 Power Amplifier Module.
  • An Avago AFEM-8065 Power Amplifier Module is also included.
  • Furthermore, an Avago AFEM-8055 Power Amplifier Module is present.
  • A Universal Scientific Industrial O1 X4, which is probably the M2800 "Trinity" Single Package, is observed.
  • A Bosch Sensortec BMP280 Barometric Pressure Sensor is also identified.

• Examining the device's backside exposes an array of integrated circuits:
  • A Toshiba THGBX6T0T8LLFXF NAND Flash chip, with a capacity of 128 GB, is present.
  • A Murata 339S00199 module provides Wi-Fi and Bluetooth functionality.
  • The NXP PN67V chip manages Near Field Communication (NFC) operations.
  • Power management is handled by a Dialog 338S00225 integrated circuit.
  • A Qualcomm PMD9645 integrated circuit also contributes to power management.
  • The Qualcomm WTR4905 facilitates multimode LTE transceiver operations.
  • Radio frequency transmission is handled by the Qualcomm WTR3925 transceiver.

• An Apple/Cirrus Logic 338S00105 Audio Codec is located on the board.
• Two Cirrus Logic 338S00220 Audio Amplifiers are incorporated into the design.
• A Lattice Semiconductor iCE5LP4K iCE FPGA is included.
• The device utilizes a Skyworks SKY13702-20 Diversity Receive Module.
• A Skyworks SKY13703-21 Diversity Receive Module is also present.
• An Avago LFI630, identified by part number 183439, is incorporated.
• A Display Port Multiplexer, specifically an NXP Semiconductor CBTL1610A3, is likely present.

• A TDK EPCOS D5315 Antenna Switch Module is present. (likely)
• A Texas Instruments SN2400AB0 Battery Charger IC is also present. (likely)
• The board incorporates a Texas Instruments TPS65730A0P Power Management IC.
• Backlight functionality is managed by Texas Instruments LM3539 drivers.
• Power management is handled by a Texas Instruments SN61280.
• An ON Semiconductor DC-DC Converter is also found on the board. (likely)

• Refer to Figures 1 and 2 for visual representation.Specifically, a plastic SIM eject tool is present, incorporating a rubber gasket for sealing.
• Figure 3 illustratesanother rubber gasket situated on the SIM card tray.

• however, several key differences exist: This particular display offers a broader P3 color gamut compared to its predecessors,
• and exhibits a 25% increase in brightness.
• Furthermore, a water damage indicator is visible on the left side of the display's EMI shield.

• Notably, this replacement earpiece speaker performs a dual function,
• acting as a loudspeaker as well.
• This feature provides the iPhone with stereo audio capabilities, suitable for music playback when headphones are unavailable.

• Front-facing camera
• MEMS Microphone
• Stereo-enabling speaker
• Proximity sensor and ambient light sensor

• Despite this progress, the volume and power buttons remain firmly secured within the device's housing, resisting standard extraction methods.
• The construction appears to echo prior Apple patent documentation concerning waterproof button mechanisms, necessitating a specialized and precise disassembly procedure.

• However, this is a temporary pause; another innovative device originating from Cupertino will be featured shortly. Please remain attentive for future updates!