Follow these instructions to either take out or substitute a defectiveThe main circuit board, containing the integrated circuits and components that control the device's functions, is referred to as the logic board.Within the iPhone 7 Plus.
For those utilizing the Anti-Clamp tool—developed to simplify the subsequent opening—proceed with the following three actions; otherwise, bypass these steps and follow the alternative instructions found three steps later.
Refer to the included guide for detailed procedures regarding Anti-Clamp operation.
Employing a suction cup, proceed with the following three steps to detach the display assembly.
Applying heat to the phone's bottom perimeter will loosen the adhesive that holds the display in place, simplifying the separation process.
Employ a hairdryer, or alternatively, generate heat using a similar device, to warm the adhesive securing the component, ensuring the temperature does not exceed 150°F (65°C) to prevent damage.Use a specialized iOpener tool.To loosen the adhesive securing the lower portion, hold a heat source against that edge for approximately 90 seconds.
Using a suction cup, secure it to the front panel's lower section, positioned directly over the home button.
To ensure a proper seal between the suction cup and the front glass, avoid positioning the cup so that it covers the home button.
Apply steady, even force to lift the suction cup, generating a small separation between the screen assembly and its surrounding frame.
Using a specialized opening tool, carefully introduce its tip into the separation.
Because the screen is secured with a robust, waterproof adhesive, separating it initially requires considerable force. Should you encounter difficulty, apply additional heat and carefully move the screen back and forth to soften the adhesive, allowing for a sufficient gap to accommodate your tool.
Avoid inserting the opening tool along the right side of the iPhone, as this area contains fragile wiring that could be harmed.
Carefully raise theThe main circuit board, containing the integrated circuits and other electronic components, is referred to as the logic board.Gently push upwards on the lower edge of the device, moving it downwards to release the component.
Exercise caution to prevent the 1.5mm diameter wire harness from being damaged by sharp edges or protrusions.The main circuit board, containing the processor and other critical electronic components, is referred to as the logic board.Ensure no cables are subjected to stress or damage.
Ensure the black grounding clip is correctly located on the upper right side during reassembly.The main circuit board, containing the integrated circuits and components that control the device's functions, is referred to as the logic board.Locate the area close to the rear cameras.The main circuit board, containing the integrated circuits and electronic components, is referred to as the logic board.Position the component so it passes beneath the clip.
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