iPhone 17 Pro Chip ID
The Apple iPhone 17 Pro's chip identification is provided here; consult ouriPhone 17 Pro disassembly instructions for additional information.We extend our gratitude
to Chunglin Chin, a valued community contributor,whose assistance made this guide possible!Detailed specifications and part numbers are included.Refer to the linked resources for complete documentation.
Step 1 | Processor Board - Outer Side
- The Kioxia K5A4CG1685 contains 256 GB of NAND flash storage.Apple's APL10xx component handles power regulation functions.A probable Apple/Cirrus Logic chip, designated 338S00x05, manages power.
- This Kioxia module provides substantial data storage capacity.The APL10xx device is responsible for efficient power distribution.The 338S00x05 component is crucial for power control.
- NAND flash memory, with 256 GB, is the Kioxia part's role.Power management is the primary function of the APL10xx module.The Cirrus Logic component, 338S00x05, regulates electrical power.
Step 2 | Processor Board - Inner Side
- The Apple APL1V12/339S01837 incorporates an A19 Pro processor.This processor utilizes a hexa-core design, alongside a GPU and Neural Engine.It's situated beneath a Samsung K3KLMLM0FM-HGGV memory module.The memory module contains 12 GB of high-speed LPDDR5X SDRAM.A Texas Instruments CP3200C1K4 component functions as a battery charger.
- The device also incorporates an NXP Semiconductors CBTL1701B0 controller.This controller manages the USB Type-C port functionality.Power management is handled by an STMicroelectronics STPMIA3A chip.
- An Apple/Cirrus Logic 338S00967 chip serves as the audio codec.Further audio processing is provided by an Apple/Cirrus Logic 338S01087.This component acts as an audio amplifier within the system.
- Another Apple/Cirrus Logic 338S01148 chip provides audio amplification.The A19 Pro processor manages complex applications efficiently.The LPDDR5X SDRAM ensures rapid data access speeds.
- The battery charger maintains optimal power levels.The USB Type-C controller enables versatile connectivity.The power management chip regulates voltage distribution.
- The audio codec converts digital signals to analog.The audio amplifiers boost the audio output signal.These components work together for enhanced performance.
- The Samsung memory module supports high-bandwidth operations.The STMicroelectronics chip optimizes energy consumption.The NXP controller facilitates data transfer protocols.
Step 3
- A common failure involves the STMicroelectronicsSTB605A11, which handles power regulation.This component manages electrical distribution.
- The Analog Devices MAX11390A serves as an analog-to-digital converter.Its function is to transform signals digitally.
- Apple utilizes the 338S01153-B1 for power management tasks.This part also controls electrical flow.
- Another Apple component is the 338S00616, a DC-DC voltage converter.It regulates voltage levels within the device.
Step 4 | Processor Board - Inner Side - Sensors
- Bosch Sensortec manufactures an accelerometer and gyroscope.
Step 5 | RF Board - Outer Side
- The MAX20348P is a DC-DC converter manufactured by Analog Devices.
Step 6 | RF Board - Outer Side - Connectivity
- The Qualcomm SDX80M-001 handles 5G modem functionality.
- Qualcomm's SDR875-004 manages radio frequency transceiver operations.
- USI's 339M00399 integrates WiFi 7, Bluetooth 6, and Thread, including Apple N1.
- Skyworks provides the SKY58480-14 for the device's front-end module.
- Broadcom's AFEM-8257 serves as a front-end module component.
- Qorvo's QM76309 is utilized within the front-end module assembly.
- It is conceivable that a component may be present.NXP Semiconductors supplies the controller for near-field communication.
Step 7 | RF Board - Inner Side
- The Broadcom BCM59367A1IUBG manages wireless charging operations.
- Power management functionality is provided by the Qualcomm PMX75-001.
- The Texas Instruments TPS65658A0 supplies power for the display.
- A wideband envelope tracker is integrated, utilizing the Qualcomm QET7100A-002.
- A potential component may be present, requiring further inspection.Camera flash operations are controlled by the Texas Instruments CP5100A0.
Step 8 | RF Board - Inner Side - Connectivity
- A probable component is the USI 339M00386 module, supporting ultra-wideband functionality and incorporating Apple's U2 chip.The NXP Semiconductors SN300 manages NFC capabilities, integrating an eSIM and a secure element for enhanced security.
- Radio frequency signals are processed by the Broadcom AFEM-8267, a specialized front-end module.
- The Qorvo QM76308 also functions as a front-end module, contributing to the device's radio performance.
- These components work together to enable wireless communication and secure transactions within the system.