iPhone 16 Pro Chip ID

The iPhone 16 Pro's internal circuitry utilizes a pair of double-sided printed circuit boards (PCBs) to manage its functions.

• The upper portion of the radio frequency (RF) board is one of these PCBs.
• The lower portion of the radio frequency (RF) board constitutes the second of these PCBs.
• The primary functions are handled by a PCB designated as the main board's upper section.
• The main board's lower section represents the final PCB within the iPhone 16 Pro's logic board assembly.

• The STMicroelectronics ST33J provides embedded SIM and secure element functionality.
• Power management capabilities are delivered by the Qualcomm PMX65-000 component.
• Audio amplification is achieved through the Cirrus Logic 338S01087.
• A Qualcomm component is responsible for generating timing signals within the device.
• The Analog Devices MAX11390A converts analog signals into digital data.

• The Qualcomm SDR735-001 serves as a radio frequency transceiver.
• Intermediate frequency communication is facilitated by the Qualcomm SMR546-002 transceiver.
• A Broadcom AFEM-8234 module manages the device's front-end operations.
• The Skyworks SKY58440-11 component provides front-end functionality.
• Qorvo's QM76307 module also contributes to the device's front-end design.

• The Texas Instruments LM3567A1 manages the operation of an LED flash.
• Wireless charging functionality is controlled by the Broadcom BCM59367A1.
• A wideband envelope tracking system is implemented using the Qualcomm QET7100-001.
• Power for the envelope tracker is supplied by a Qorvo power supply.
• The Apple 338S00616 provides direct current-to-direct current voltage conversion.

• The device incorporates a Qualcomm SDX71M-000 modem for cellular connectivity.
• A Skyworks component serves as the radio frequency front-end module.
• The front-end functionality is further supported by a Qorvo QM76306 module.
• Near-field communication capabilities may be managed by an NXP Semiconductors NFC controller.

• The Micron MT62F1G64D4AQ-031 XT:C, a LPDDR5X SDRAM memory module, is integrated with the Apple APL1V07 / 339S01527 A18 Pro processor, which incorporates a graphics processing unit (GPU) and a neural engine, utilizing a hexa-core architecture.
• The Apple APL109A / 338S01119 component handles power distribution within the device.
• Power management functionality is also provided by the STMicroelectronics STPMIA3C.
• A 1 MB serial NOR flash memory chip, specifically the GigaDevice GD25Q80E, is present for data storage.

• The USI 339M00326 represents a module utilizing ultra-wideband (UWB) radio technology.

• The device incorporates a Kioxia K5A3RF9864 NAND flash memory chip with a storage capacity of 128 GB.
• A probable component is the Texas Instruments SN2012027, which functions as a USB Type-C controller.Powering the battery is a Texas Instruments CP3200B1G0 integrated charger circuit.
• Audio processing is handled by the Cirrus Logic 338S00967 audio codec.Sound amplification is provided by the Cirrus Logic 338S01087 audio amplifier.
• The display receives power through the Texas Instruments TPS65657B0 power supply IC.
• The presence of this component is highly probable.
• The Cirrus Logic 338S00843 manages power distribution within the system.
• The NAND flash memory chip is identified as a Kioxia K5A3RF9864 with a 128 GB capacity.The USB Type-C functionality is facilitated by the Texas Instruments SN2012027 controller.

• The integrated circuit originates from Texas Instruments.This component is identified as the TPS61280H.It functions as a battery front-end DC-DC converter.
• Apple utilizes this device in their product designs.The specific part number assigned by Apple is 338S01026-B1.Its primary role is within the overall power management system.

• The component originates from USI, identified by the part number 339S01464.This module integrates Bluetooth and WiFi communication capabilities.NXP Semiconductors manufactures the described module.
• The integrated circuit also incorporates a Near Field Communication (NFC) controller.Refer to the manufacturer's documentation for detailed specifications regarding this integrated module.