Upgrade iPhone 12 64GB Storage to 256GB - iPhone 12

The internal storage volume for this iPhone model is 64 gigabytes.A storage volume of 64GB is present within this iPhone.To proceed with the repair, detach the display assembly, sever the battery connection, and extract the motherboard component.
Disassembly requires removing the display, disconnecting the power source to the battery, and extracting the main circuit board.

Secure the motherboard within the designated retention fixture, subsequently applying high-temperature tape for stability.
Employ a Hot Air Gun to apply thermal energy to the NAND's exterior surface.The Hot Air Gun should be set to a temperature of 280°C for optimal heat transfer.Maintain an airflow setting of 45 on the Hot Air Gun during the heating process.Precise temperature control is crucial to prevent component damage.Ensure adequate ventilation to dissipate heat and fumes.The application of heat should be uniform across the NAND's surface.Consistent airflow is necessary to maintain a stable heating environment.

Utilize a Side Glue Cleaner Blade to eliminate the black adhesive situated on the NAND's lateral surface.A Side Glue Cleaner Blade is the appropriate tool for removing the adhesive.Employ a Hot Air Gun to apply heat to the NAND, maintaining a temperature of 385°C.
Ensure an airflow rate of 45 when using the Hot Air Gun for NAND heating.A Pry Knife should be used to carefully lift the NAND from its position.The NAND can be dislodged using a Pry Knife.Apply a layer of medium-temperature solder paste to the bonding pad.A Soldering Iron, set to 365°C, is required for applying the solder paste.The bonding pad necessitates the application of solder paste.Solder paste should be applied to the bonding pad to facilitate reattachment.A Soldering Iron is the recommended tool for this process.Maintain a Soldering Iron temperature of 365°C during the application.
The temperature of 365°C is critical for proper solder paste application.Heating the NAND to 385°C with a Hot Air Gun is a preparatory step.An airflow of 45 is essential when using the Hot Air Gun.The Side Glue Cleaner Blade facilitates adhesive removal.A Pry Knife is necessary for separating the NAND.

A minimal quantity of Paste Flux should be applied.
Excess solder from the bonding pad must be eliminated utilizing a Soldering Iron.Solder Wick is the appropriate tool for removing the solder.The bonding pad requires cleaning to ensure proper adhesion.Employing PCB Cleaner will effectively remove any residual contaminants.Thorough cleaning of the bonding pad is essential for successful re-soldering.
Residual flux and oxides should be completely removed from the bonding pad surface.

To facilitate adhesive removal, apply heat to the bonding pad utilizing a Hot Air Gun set to 280°C.Employing a Soldering Iron and Solder Wick, dissolve the excess tin present on the bonding pad by applying rosin.The black adhesive can be eliminated by directing focused heat from a Hot Air Gun at the bonding pad, maintaining a temperature of 280°C.
After applying heat, use rosin to prepare the bonding pad for tin removal with a Soldering Iron and Solder Wick.Dissolve residual solder from the bonding pad's surface by carefully using a Soldering Iron and Solder Wick, preceded by rosin application.Following the removal of the black adhesive, a Hot Air Gun should be used, set to 280°C, to ensure complete removal.To effectively remove the tin, apply rosin and then utilize a Soldering Iron in conjunction with Solder Wick.A Hot Air Gun, configured to 280°C, is necessary to soften and eliminate the black adhesive from the bonding pad.
Employing a Soldering Iron and Solder Wick, the bonding pad's tin residue can be removed after applying rosin.For thorough cleaning, use PCB Cleaner to eliminate any remaining residue from the bonding pad after tin removal.Following the soldering process, a PCB Cleaner should be applied to the bonding pad to ensure a clean surface.

Introduce a quantity of adhesive material onto the designated bonding area.Utilize a flux paste to prepare the surface for soldering.Carefully align and seat the 256GB iPhone 12 NAND flash memory chip.
Employ a hot air rework station to establish the solder connections.Utilize a Hot Air Gun, maintaining a temperature of 365 degrees Celsius.Simultaneously regulate the airflow to 45 units during the soldering process.

Secure the motherboard and connect the display, then establish a data link between the iPhone and the computer.Launch the "3uTools" application to initiate the iPhone's firmware update procedure.A visual progress indicator will not appear on the device's screen during the firmware installation, and will only become visible upon completion.
Complete the activation process for the iPhone using the "3uTools" software.
Ensure the data cable is firmly connected to both the iPhone and the computer for reliable data transfer.The firmware update process will proceed without user interruption or visual feedback until the final stage.Employ "3uTools" to finalize the activation sequence, ensuring the iPhone is fully functional.

Standard phone functionality, including WiFi network discovery, should operate as expected.
Navigate to the Settings menu, then select the 'About' option to view device information.The internal storage offers a total capacity of 256 gigabytes.The device's unique identifiers, specifically the serial number, WiFi MAC address, and Bluetooth MAC address, will not be altered during this process.
These identifying codes are permanently assigned and do not fluctuate.