iPhone 11 Pro Max Teardown

• The device incorporates an A13 Bionic SoC. This system includes a third-generation Neural Engine for enhanced machine learning capabilities.
• A vibrant 6.5-inch Super Retina XDR OLED display, boasting a resolution of 2688 × 1242 pixels and a pixel density of 458 ppi, is present.The display features True Tone technology and HDR support, but lacks 3D Touch functionality.
• The rear camera system comprises three 12 MP lenses, specifically a ultra-wide, a standard wide, and a telephoto lens.) complemented by a 12 MP front-facing camera integrated with TrueDepth FaceID hardware for secure facial recognition.
• The device offers 64 GB of internal storage capacity, with 256 GB and 512 GB options available for expanded storage.)
• Connectivity is provided through Gigabit-class LTE, Wi-Fi 6, Bluetooth 5.0, and NFC.
• The device is certified with an IP68 rating for dust and water resistance.

• The power cell within the 11 Pro Maxexhibits a similar single-cell architecture observed previously in the iPhone XS, signifying its initial integration into a 'Max' model.
• Apple has seemingly reduced the size of the main circuit board once more, a modification likely implemented to accommodate the substantial, three-lens camera system.
• Finally, a previously unseen circuit board appears to be positioned beneath the battery, suggesting a potential new component.
  It is possible that this component is connected to the speculated reverse wireless charging capability.

The current iPhone generation incorporates additional material thickness in the central area and significantly more around the camera lenses.

The term "camera bump" appears insufficient to describe the protrusion; perhaps "mesa" would be a more suitable descriptor.
The camera housing on this iPhone features sloped edges that integrate more seamlessly with the rear panel.
Crucially, our device arrived in Apple's newest hue:Boba Midnight green.

Prior to commencing the disassembly of this green-colored device, two additional observations are warranted: a repositioned Apple logo, and a revised model identifier located within the SIM card compartment,A2161.

The latest iPhone model follows a familiar disassembly process, albeit with a notable modification.
To begin, a specialized P2 driver, sourced from the new iPhone-dedicated Marlin toolset, is utilized to disengage the pair of pentalobe screws.
Subsequently, an iSclack tool and an opening pick are employed to complete the separation, allowing for the display's upward movement.
Although Apple designates this iPhone as their "most water-resistant iPhone ever", the adhesive securing the display exhibits a comparable consistency to previous models, mirroring the historical pentalobe screw-based sealing method.

• Let's begin our initial inspection of the Professional Maximum iPhone which incorporates a notably large, L-shaped battery design featuring two battery connectors – a novel characteristic.
• The presence of this additional cable might stem from several factors; however, bidirectional charging capabilities appear to be a likely explanation.
• Evaluation procedures produced the subsequent findings:
  • The device remains operational even if the charging-port-end is detached (reestablishing the connection triggered a transient temperature alert).
  • With the lower cable disconnected, power can be delivered to the phone through the Lightning port, but the wireless charging coil will remain inactive.
  • Severing the primary cable, which connects directly to the logic board, resulted in the phone's complete shutdown; it failed to power on, even when the secondary cable remained attached.

Contemporary smartphone manufacturers have prioritized software enhancements to elevate image quality; consequently, it might be unexpected to learn that Apple dedicated significant effort to camera hardware improvements this year.
The most substantial advancement involves a novel ultra-wide angle sensor and lens combination, while the standard wide-angle and telephoto lenses also experience improvements in their ISO range and shutter speed capabilities. Furthermore, the front-facing camera receives a modest resolution increase.
Comprehensive technical specifications regarding the camera system can be found in Halide's detailed analysis.
The FaceID sensor array has undergone advantageous modifications as well: the front-facing camera now features a 12 MP resolution – a rise from the previous 7 MP – and its connecting cables are no longer constrained beneath the battery, facilitating a faster and simpler disassembly process.

A trio of camera lenses, accompanied by a flash and a microphone aperture, are prominently featured.
Upon closer inspection, the cameras are grouped closely, each connected by a separate cable.
Radiographic analysis indicates minimal unexpected elements; the dark lines confirm the presence of Optical Image Stabilization (OIS), and the small markings appear consistent with components from the previous model year, suggesting the absence of discrete RAM chips—likely.
However, our assessment doesn't conclude here; we will proceed with a more detailed examination—further details will follow shortly.

The iPhone Marlin driver set remains essential, facilitating the release of the last remaining screws that hold the uniquely rectangular logic board in place.
Reducing from a shape reminiscent of Idaho to a form more akin to Colorado demonstrates the increased density of the iPhone 11 Pro Max's board!
Is this a case of duplication? Rest assured, we've noticed it too! The iPhone 11 Pro Max's logic board shares the exact same design as the one found in the iPhone 11 Pro.
Is it possible these boards are truly identical? Further updates will follow...

The device maintains its previous form factor, utilizing the identical dual-layer construction and disassembly method.

• Applying significant, focused heat combined with gentle leverage allows the upper circuit board to be detached from the connecting board.
• This reveals a view of the highly regarded A13 processor, alongside numerous other integrated circuits densely packed onto these compact circuit boards.

Employing specialized inspection equipment to detect microscopic flaws, we began our analysis, and the following components have been identified thus far.

• AppleAPL1W85, an A13 Bionic System-on-Chip (SoC)is situated atopSK Hynix H9HKNNNCRMMVDR-NEH utilizing LPDDR4X technology,appearing to have a capacity of 4 GB, although SK Hynix's decoding software requires an update for accurate confirmation.
• AppleAPL1092, identified as a 343S00355 Power Management Integrated Circuit (PMIC)
• Cirrus Logic338S00509, a dedicated audio codec.
• An unlabeled USI module; a subsequent teardown revealed that this component houses Apple's newly introducedU1 ultra-wideband chip.A detailed examination of this discovery is available in our accompanying blog post.
• Avago8100, a Mid/High band PAMiD (Pulse Amplitude Modulated with Index Modulation device)
• Skyworks78221-17, a low-band PAMiD.
• STMicroelectronicsSTB601A0N, a power management integrated circuit.

• Apple/USI339S00648, a WiFi/Bluetooth System on a Chip (SoC)
• IntelX927YD2Q, which is probably an XMM7660 modem
• Intel5765 P10 A15 08B13 H1925, a transceiver
• Skyworks78223-17, a Power Amplifier Module (PAM)
• 81013, manufactured by Qorvo, is an Envelope Tracking component
• Skyworks 13797-19, a DRx (Receive) component
• Intel 6840 P10 409 H1924, a baseband Power Management Integrated Circuit (PMIC)

• A Toshiba TSB 4226VE9461CHNA1, identified by the serial number 1927, incorporates 64 GB of flash memory storage.
• A YY NEC 9M9 component, presumably functioning as an accelerometer/gyroscope, is also present.
• Furthermore, multiple layers of graphite, utilized for thermal dissipation, are carefully separated from the RF board.
• According to Apple's specifications, the enhanced thermal architecture of these iPhone Pro models delivers the highest sustained performance previously achieved in an iPhone, achieved by channeling heat from the logic board through several graphite layers to the rear case.
• Although this design may lack the sophistication of liquid cooling systems found in certain Android devices, it demonstrably provides sufficient cooling for the highly efficient A13 processor, without disrupting signal transmission to or from the adhered RF board.

• The primary obstacle is the Taptic Engine; once this component is removed, the battery is held in place by a small number of extended, robust stretch-release adhesive strips.
• The ease of this procedure closely resembles the battery replacement process on the iPhone 6, differing from the complexities seen in newer models.
• With the adhesive strips released, the battery can be carefully lifted away from the iPhone.

• The source of this considerable power resides in a component that measures 4.6 mm in thickness, occupies a volume of 23.8 cm3, and has a mass of 59.6 g. These dimensions represent a 0.7 mm increase in thickness, a 4.2 cm3 expansion in volume, and a 13 g rise in weight relative to the XS Max.
• Initial skepticism arose from Apple's suggestion that the A13 chip and PMU were solely accountable for the advertised five-hour extension in battery life. However, the solution appears to be a straightforward increase in device thickness to achieve significant improvements in battery performance. This approach was unexpected.
• A similar single-cell, L-shaped battery configuration was previously utilized in the iPhone XS, providing valuable insight into the challenges associated with internal corner design and the effects of thermal expansion on battery construction.

• Notably, this iPhone incorporates a secondary battery connector, a first for Apple devices, positioned directly near the wireless charging coil; the purpose of this design remains unclear.
• Apple recently released a support document confirming the iPhone 11 Pro includes updated hardware for overseeing and controlling battery operation; this component may be related to that function, despite its resemblance to wireless charging circuitry.
• Removal reveals a redesigned barometric sensor, incorporating a sealing o-ring for protection against environmental ingress.
• The components located on this section of the phone are affixed to the frame using a more viscous and adhesive substance compared to the foam-based adhesive previously utilized, likely intended to enhance waterproofing.

1. To investigate the components within, we will now disassemble the interconnect board.
   • An STMicroelectronics STPMB0 929AGK chip, identified by the marking HQHQ96 153915, is present.
   • Several Apple 338S00411 audio amplifiers are also located on the board.
   • A Texas Instruments chip, model 97A8R78, with serial number SN261140 A0N0T, can be found.

The XS Max display exhibited no functional defects, aside from its considerable cost; consequently, the visual similarity of this year's XDR display was anticipated.
Despite this, the XDR display lacks a $999 stand, rendering it essentially inoperable without one.
A beneficial, albeit small, improvement involves the consolidation of the three flex cables into a single location, which reduces the potential for unexpected complications during the repair disassembly process.
The absence of the 3D Touch layer’s impact was less significant than initially projected; the display’s thickness is approximately 0.25 millimeters less than the previous model, a change coupled with a slight increase in the iPhone’s overall dimensions, and these factors collectively contribute to the enhanced battery capacity.
A final component, concealed beneath a protective shield, is the Samsung S2D0S23 display power management integrated circuit.

When removing the Lightning connector assembly, it will be affixed to the new interconnect board; expect considerable resistance due to the complex combination of screws and adhesives securing it, potentially complicating the process if either component malfunctions.
A final inspection of each camera module is performed to locate a second, difficult-to-find RAM chip; beyond exposed, unprotected sensors, nothing is initially observed, but a discovery is made.
The component identified is an AD5844CDA0 chip, likely functioning as an image stabilizer, and possibly housing a leprechaun commune.

Upon inspection of the rear enclosure, we observe the presence of what appears to be three supplementary thermal interface pads.
Radiographic analysis indicates that each of these pads is positioned directly over a precisely manufactured aperture within the steel case, suggesting a deliberate design choice.
Notably, each thermal pad is linked through a flexible cable to a sophisticated antenna distribution network.
While the precise function remains unconfirmed, the configuration strongly implies the presence of ultra-wideband antenna components.

The disassembly process has reached an exceptional level of detail, and the following observations were made.
The device incorporates a significantly larger battery, achieved through a body increase of 0.4 millimeters and a reduction of 0.25 millimeters from the 3D Touch functionality.
Two battery cables are present, which potentially facilitated Apple's previously discontinued symmetrical charging capability, although they could also serve to optimize battery performance.
A preliminary assessment indicates a "4 GB" memory capacity,is provided, acknowledging the difficulty in locating dedicated camera RAM.
Additionally, several radio frequency antennas are present, which are believed to enhance the U1 chip's spatial awareness capabilities.
Further disassembly reports will be released in the near future; please refrain from making adjustments at this time.